Socket AM5

Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA)^[1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture.^[2][3] AM5 was launched in September 2022 and is the successor to AM4.^[4]

Socket AM5

Release date	September 27, 2022 (2022-09-27)
Designed by	AMD
Manufactured by	Lotes, Foxconn
Type	LGA-ZIF
Chip form factors	Flip-chip
Contacts	1718
FSB protocol	PCI Express, Infinity Fabric
Voltage range	0.8V (cores) 1.05V (in-package I/O die)
Processor dimensions	40mm × 40mm 1,600mm2
Processors	Ryzen: Ryzen 7000 Series (Raphael) Ryzen 8000(G) Series (Phoenix) Ryzen 9000 Series (Granite Ridge) Epyc: Epyc 4004 Series
Predecessor	AM4
Memory support	DDR5
This article is part of the CPU socket series

The Ryzen 7000 series processors were the first AM5 processors. The 7000 series added support for PCI Express 5.0 and DDR5.^[5]

Background

In March 2017, with the launch of its new Zen processors, AMD used the AM4 socket that they had previously used with their Bristol Ridge (derived from Excavator) powered Athlon X4 and some A-Series, a pin grid array (PGA) socket that they promised to support until 2020.^[6]

Announcement

At CES 2022, AMD CEO Lisa Su unveiled the AM5 socket and the integrated heat spreader design for the upcoming Ryzen 7000 processors due in late 2022.

On May 23, 2022, AMD provided details about the AM5 socket, its corresponding motherboards, and Ryzen 7000 Series CPUs at Computex in Taipei, Taiwan.^[7] At Computex, motherboard vendors ASRock, Gigabyte and others debuted their new X670 motherboards featuring the AM5 socket.^[8][9]

AMD stated that it plans to support the AM5 socket for a number of years as it did with the AM4 socket.^[10] During the Ryzen 7000 series reveal on August 29, 2022, AMD confirmed that it would support the AM5 socket until at least 2025.^[11] At Computex 2024, AMD announced that this support period would then be extended through 2027.^[12]

Features

• Supports DDR5 in dual-channel configuration. DDR4 is not supported, unlike Intel's LGA 1700 socket.^[13]
• Support for PCIe 5.0 lanes from the CPU on X870E, X870, X670E and B650E chipsets.^[14]
• Achieves 170 W TDP^[i] and a Package Power Tracking (PPT)^[ii] limit up to 230 W.^[15]

Image of the AM5 socket with the Socket Actuation Mechanism (SAM) in open position, exposing the pins

Pin map of the AM5 socket from AMD

Heatsink

The AM5 socket specifies the 4 holes for fastening the heatsink to the motherboard to be placed at the corners of a rectangle with a lateral length of 54×90 mm, as well as UNC #6-32 screw threads for the backplate, identical to those of the preceding AM4 socket. Furthermore, the Z-height of the CPU package is kept the same as that of AM4, for backward compatibility of heatsinks.^[16]

Unlike AM4, the backplate on AM5 is not removable, as it also serves the purpose of securing the CPU retention mechanism for the LGA socket.^[17]

Not all existing CPU coolers from AM4 are compatible. In particular, coolers that use their own backplate mounting hardware, instead of the default motherboard-provided backplate, will not work. Some cooler manufacturers are offering upgrade kits to allow incompatible older coolers to be used on AM5.^[18][19]

Chipsets

			Branding
			A620	B650	B650E	X670	X670E	B840	B850	X870	X870E
Platform features	PCIe 5.0 support[a]	x16 slot	No	No	Yes	No	Yes	No	Optional	Yes	Yes
		M.2 slot + 4× GPP	No	M.2 Optional	Yes	Yes	Yes	No	Yes	Yes	Yes
	x16 slot configurations		1×16	1×16 or 2×8				1×16	1×16 or 2×8
	Multi-GPU	CrossFire	No	Yes	Yes	Yes	Yes	No		Yes	Yes
		SLI	No	No	No	No	No	No	No	No	No
	USB4 Gen 3×2 (40 Gb/s)[b]		Optional	Optional	Optional	Optional	Optional	Optional	Optional	Yes	Yes
	Wi-Fi version[b][c]		6							7
	Processor overclocking		No	Yes	Yes	Yes	Yes	No	Yes	Yes	Yes
Chipset specifications	PCIe lanes[d]	Gen 4	None	×8		×12		x10	x12	×8	×12
		Gen 3	Up to ×8	Up to ×4		Up to ×8		Up to x4	Up to ×4	Up to ×8
	USB support	USB 2.0	6			12				6	12
		USB 3.2 Gen 1x1 (5 Gb/s)	2	None						None
		USB 3.2 Gen 2x1 (10 Gb/s)	2	4		8		2	6	4	8
		USB 3.2 Gen 2x2 (20 Gb/s)	None	1[e]		2[f]		None	1[e]		2[f]
	Storage features	SATA III ports	Up to 4			Up to 8		Up to 4			Up to 8
		RAID	0, 1, 10
	Chipset TDP		~4.5 W	~7 W		~14 W[g]				~7 W	~14 W[g]
	Architecture		Promontory 21 ×1			Promontory 21 ×2				Promontory 21 ×1	Promontory 21 ×2
	Chipset links	To CPU	PCIe 4.0 ×4
		Interchipset	—			PCIe 4.0 ×4				—	PCIe 4.0 ×4
CPU support		Zen 4	Yes
		Zen 5	Yes
Release date			Mar 31, 2023	Oct 10, 2022		Sep 27, 2022		Jan 6, 2025		Sep 2024
Reference(s)			[20][21][22]	[20][23][24]						[20][25][26][27]

• v
• t
• e

1. Support for Gen5 speeds on lanes directly from CPU to expansion and M.2 slots, and general-purpose lanes.
2. Provided by a third-party controller.
3. Motherboard makers may omit Wi-Fi on some models.
4. PCIe lanes provided by the chipset. The CPU provides other PCIe 5.0 and/or 4.0 lanes.
5. The motherboard maker may configure the USB 3.2 provided by the chipset as 6× 3.2 Gen 2x1 and 0× 3.2 Gen 2x2 ports.
6. The motherboard maker may configure the USB 3.2 provided by the chipset as 10× 3.2 Gen 2x1 and 1× 3.2 Gen 2x2 ports, or 12× 3.2 Gen 2x1 and 0× 3.2 Gen 2x2 ports.
7. Two Promontory 21 chipsets are present, each having a TDP of ~7 W, giving a total TDP of ~14 W.

See also

• Socket sTR5, a socket for AMD HEDT and workstation CPUs
• Socket SP5, a socket for AMD server CPUs

Notes

1. Thermal design power
2. Electrical power dissipation