LGA 1700

LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.

LGA 1700

Release date	November 4, 2021 (2021-11-04)
Designed by	Intel
Manufactured by	Lotes
Type	LGA-ZIF
Chip form factors	Flip-chip
Contacts	1700
FSB protocol	PCI Express 5.0 Direct Media Interface
Processor dimensions	37.5 mm × 45 mm 1,687.5mm2
Processors	Alder Lake Raptor Lake
Predecessor	LGA 1200
Successor	LGA 1851
Memory support	DDR4 DDR5[1]
This article is part of the CPU socket series

LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.^[2]

Heatsink design

Since the introduction of land grid array (LGA)-based sockets in the consumer hardware space in 2004,^[3] the thermal solution hole pattern (the distance between centers of the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms:

• For LGA 775, it is 72 mm × 72 mm
• For LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200 it is 75 mm × 75 mm
• For LGA 1700, LGA 1851, it is 78 mm × 78 mm

While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit^[4][5][6] for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS and the static total compressive minimum need to match.

Issues

Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x and LGA1200 retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 integrated loading mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures.^[7] LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact.^[8][9]

Maximum RAM

Initially motherboards based on Alder Lake and Raptor Lake chipsets supported 32 GB memory modules but most known OEMs in 2023 updated their UEFI to support 48 GB modules and in December 2023 support for 64 GB modules started to roll out first by MSI and ASRock.^[10][11] Users are advised to consult with their motherboards web support pages to check what memory modules can be installed.

Alder Lake chipsets (600 series)

			H610[12]	B660[13]	H670[14]	Q670[15]	Z690[16]	W680[17]
Overclocking			No	RAM; BCLK on some ASRock, ASUS and MSI motherboards[18][19][20][21]	RAM only	No	Yes
Bus interface			DMI 4.0 ×4		DMI 4.0 ×8
CPU support			Alder Lake Raptor Lake (a BIOS update may be required)
Memory capacity			Up to 64/128 GB[a]	Up to 128/256 GB[a]				Up to 128/256 GB with ECC[a]
Maximum DIMM slots			2	4
Maximum USB 2.0 ports			10	12	14
USB 3.2 ports configuration	Gen 1x1		Up to 4	Up to 6	Up to 8	Up to 10
	Gen 2	×1	Up to 2	Up to 4		Up to 8	Up to 10
		×2	None	Up to 2		Up to 4
Maximum SATA 3.0 ports			4		8
Processor PCI Express configuration		5.0	1×16		1×16 or 2×8
		4.0	None	1×4
PCH PCI Express configuration		4.0	None	6	12
		3.0	8		12		16
Independent display support (digital ports/pipes)			3	4
Integrated wireless			suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3)[b]
PCIe RAID support			No		0, 1, 5
SATA RAID support			No	0, 1, 5, 10[22]
Intel Optane memory support			No	Yes
Intel Smart Sound[23] technology			Yes
Intel Active Management, Trusted Execution and vPro technology			No			Yes	No	Yes
Chipset TDP			6 W
Release date			Q1 2022				Q4 2021	Q2 2022

1. RAM capacity might be limited to the first number before a BIOS update
2. Depends on OEM's implementation. OEMs include Wi-Fi chips as optional M.2 CNVio2 boards and can also choose from previous generations, such as the AX201 (Wi-Fi 6 / BT 5.2).

Raptor Lake chipsets (700 series)

			B760[24]	H770[25]	Z790[26]
Overclocking			RAM; BCLK on some ASRock and MSI motherboards, 12th Gen CPUs only. 13th Gen disabled BCLK OC at CPU microcode level[27][28][29]	RAM only	Yes
Bus Interface			DMI 4.0 ×4	DMI 4.0 ×8
CPU support			Alder Lake and Raptor Lake
Memory capacity			Up to 128/256 GB[a]
Maximum DIMM slots			4
Maximum USB 2.0 ports			12	14
USB 3.2 ports configuration	Gen 1x1		Up to 6	Up to 8	Up to 10
	Gen 2	×1	Up to 4		Up to 10
		×2	Up to 2		Up to 5
Maximum SATA 3.0 ports			4	8
Processor PCI Express configuration		5.0	1x16	1×16 or 2×8
		4.0 (for M.2)	1x4
PCH PCI Express configuration		4.0	10	16	20
		3.0	4	8
Independent display support (digital ports/pipes)			4
Integrated wireless			Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3)[b]
PCIe RAID support			No	0, 1, 5
SATA RAID support			0, 1, 5, 10
Intel Optane memory support			No
Intel Smart Sound technology			Yes
Intel Active Management, Trusted Execution and vPro technology			No
Chipset TDP			6 W
Release date			Q1 2023		Q4 2022

1. RAM capacity might be limited to the first number before a BIOS update
2. depends on OEM's implementation

See also

• List of Intel microprocessors
• List of Intel chipsets