List of Qualcomm Snapdragon systems on chips

Smartphone electronics product line From Wikipedia, the free encyclopedia

The Qualcomm Snapdragon suite of systems on chips (SoCs) are designed for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

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Qualcomm Snapdragon
General information
LaunchedNovember 2007
(17 years ago)
 (2007-11)
Designed byQualcomm
Architecture and classification
ApplicationMobile SoC and 2-in-1 PC
MicroarchitectureARM9, ARM11, ARM Cortex-A, Cortex-X1, Cortex-X2, Cortex-X3, Cortex-X4, Scorpion, Krait, Kryo, Oryon
Instruction setARMv6, ARMv7-A, ARMv8-A, ARMv9-A
Physical specifications
Cores
  • 1, 2, 4, 6, 8 or 12
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Before Snapdragon

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SoC made by Qualcomm before it was renamed to Snapdragon.[1]

  • MSM (Mobile Station Modem)
  • QSC (Qualcomm Single Chip)
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Snapdragon S series

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Snapdragon S1

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Features of the Snapdragon S1 series
Snapdragon S1 notable features over its predecessor (MSM7xxx):
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Snapdragon S2

More information Features of the Snapdragon S2 series ...
Features of the Snapdragon S2 series
Snapdragon S2 notable features over its predecessor (Snapdragon S1):
  • CPU feature
    • 1 core up to 1.5 GHz Scorpion
    • ARMv7 (from ARMv6 on some model)
    • Up to 384K L2
  • GPU features
  • Memory features
    • Up to LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s)
  • DSP features
  • 45 nm manufacturing technology
  • 904 pins[28]
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Snapdragon S3

More information Features of the Snapdragon S3 series ...
Features of the Snapdragon S3 series
Snapdragon S3 notable features over its predecessor (Snapdragon S2):
  • CPU feature
    • 2 cores up to 1.7 GHz Scorpion
    • 512 KB L2
  • GPU features
  • DSP features
  • ISP features
    • Up to 16 MP camera (from 12 MP)
  • 45 nm manufacturing technology
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Snapdragon S4

Snapdragon S4 was offered in three models: S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.[32] It was launched in 2012. The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro).

Snapdragon S4 Play

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Snapdragon S4 Plus

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Features of the Snapdragon S4 Plus series
Snapdragon S4 Plus notable features over its predecessor (Snapdragon S3):
  • CPU features
    • 2x cores up to 1.7 GHz Krait 200
    • 4+4 KB L0, 16+16 KB L1, 1 MB L2
    • Out of Order Execution (from Partial Out of Order Execution on Scorpion)
  • GPU features
    • Adreno 225
      • Up to 1080p screen
      • Up to 6 times faster than Adreno 200[25]
      • Up to 32 ALU
      • Direct3D feature level 9.0 (from 9.0)[25]
      • up to ×7.5 relative performance on OpenGL ES 2.0 from Adreno 200[26]
    • Adreno 305
      • Up to 1080p screen (on 400 MHz)
      • Up to 720p screen (on 320 MHz)
      • Up to 24 ALU (from 32 on S3)
      • Unified shader model Scalar instruction set (from unified shader model 5-way VLIW)
      • up to ×8 relative performance on OpenGL ES 2.0 from Adreno 200[26]
  • DSP features
    • Up to 20 MP or 13.5 MP camera
  • ISP features
  • Modem and wireless features
  • 28 nm manufacturing technology
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Snapdragon S4 Pro and S4 Prime (2012)

More information Features of the Snapdragon S4 Pro series ...
Features of the Snapdragon S4 Pro series
Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):
  • CPU features
    • up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro
    • up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime
    • 4+4 KB L0, 16+16 KB L1, 1 MB L2
  • GPU features
  • DSP features
  • ISP features
    • Up to 20 MP camera
  • Modem and wireless features
    • LTE FDD/TDD Cat 3 or external on some models
  • 28 nm LP manufacturing technology
  • Up to eMMC 4.4/4.4.1
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  1. Natural language processor and contextual processor

Snapdragon 2 series

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The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 series (2013–2019)

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Snapdragon 4 series

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The Snapdragon 4 series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 series, which were aimed at ultra-budget segment. Similar to the 2 series, it is the successor of the S4 Play.

Snapdragon 400 series (2013–2021)

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Snapdragon 4 (2022–2024)

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  1. Also known as "Leading Version".

Snapdragon 6 series

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The Snapdragon 6 series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon line-up, appearing in mainstream devices of various manufacturers.

Snapdragon 600 series (2013–2023)

Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series became a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.

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Snapdragon 6 (2022–2024)

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Snapdragon 7 series

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On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.[132]

Snapdragon 700 series (2018–2022)

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Snapdragon 7 (2022–2024)

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Snapdragon 8 series

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The Snapdragon 8 series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800 series (2013–2021)

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Snapdragon 8 (2022–2025)

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  1. This chipset was first released with the Galaxy S23 series.[235] It made its way to non-Samsung devices with the release of ZTE Nubia's Red Magic 8S Pro[236] on July 5, 2023[237] in which the chipset is referred to as "Leading Version".
  2. Also known as "Leading Version".

Snapdragon 8 Elite, 8s Gen 4 (2025)

The Snapdragon 8 Elite was announced on October 22, 2024.[243]

More information Features of the Snapdragon 8 Elite series ...
Features of the Snapdragon 8 Elite series
Notable features over its predecessor (8 Gen 3):
  • Support for memory up to 5333.5 MHz (up from 4800 MHz)
  • CPU features
    • 2 Oryon Prime cores up to 4.32 GHz
      • 12 MB L2 cache
    • 6 Oryon Performance cores up to 3.53 GHz
      • 12 MB L2 cache
    • 45% performance uplift and 44% power efficiency improvement
    • 8 MB SLC, no L3 cache
  • GPU features
    • Adreno 830 GPU with API support: OpenGL ES 3.2, OpenCL 3.0, Vulkan 1.3
    • Uses a sliced architecture, with 3 slices with 4 CUs per slice
      total 12 CU and 4 MB cache each in the Adreno 830.
    • 40% faster graphics rendering and 40% more power efficient
  • DSP features
    • Hexagon NPU 45% AI performance improvement
      and 45% better performance per watt
  • ISP features
    • Limitless Segmentation
    • Al Relighting
    • Al Pet Suite
    • Video Magic Eraser
  • Modem and wireless features:
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The Snapdragon 8s Gen 4 was announced on April 2, 2025.

More information Product name (Model number), Fab ...
Product name
(Model number)
Fab Die
size
CPU (Cores/Freq) GPU DSP ISP Memory
technology
Modem Connectivity Quick
Charge
Released
Snapdragon
8 Elite[244]
(SM8750-AB)
3 nm
(TSMC
N3E)
124.1
mm2
[191]
Oryon
2 + 6 cores
(4.32 GHz
Prime cores
+ 3.53 GHz
Performance
core)
Adreno 830
1100 MHz
(3379.2
GFLOPS
in FP32)
Hexagon Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR) LPDDR5X
dual-channel
32-bit (64-bit)
5333.5 MHz
(85.4 GB/s)
Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) FastConnect 7900,
Bluetooth 6.0,
802.11ax/be
(Wi-Fi 7) @ 5.8 Gbit/s,
GPS, QZSS, Glonass, NavIC, Beidou, Galileo,
USB 3.1
5 Q4 2024
Snapdragon
8 Elite
(SM8750-3-AB)
Oryon
2 + 5 cores
(4.32 GHz
Prime cores
+ 3.53 GHz
Performance
core)
Q1 2025
Snapdragon
8 Elite for Galaxy
(SM8750-AC)
Oryon
2 + 6 cores
(4.47 GHz
Prime cores
+ 3.53 GHz
Performance
core)
Adreno 830
1200 MHz
(3686.4
GFLOPS
in FP32)
Q1 2025
Snapdragon
8s Gen 4[245]
(SM8735)
4 nm
(TSMC
N4P)
Kryo
(1× 3.2 GHz Cortex-X4
+ 3× 3.0 GHz Cortex-A720
+ 2× 2.8 GHz Cortex-A720
+ 2× 2.02 GHz Cortex-A720)
Adreno 825
1150 MHz
(2355.2
GFLOPS
in FP32)
Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) Internal (5G NR Sub-6: download up to 4.2 Gbit/s) Q2 2025
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Mobile Compute Platforms

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Snapdragon 835 and Snapdragon 850

The first and second generations of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.[203]
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.[246] It is essentially an over-clocked version of the Snapdragon 845.

More information Product name (Model number), Fab ...
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(Model number)
Fab CPU (ARMv8) GPU DSP ISP Memory
technology
Modem Connectivity Quick
Charge
Sampling
availability
Snapdragon
835[247]
(MSM8998)
10 nm
(Samsung
10LPE)
Kryo 280 4 + 4 cores

(2.6 GHz + 1.9 GHz)

Adreno 540 710 MHz (363.5 GFLOPS in FP32) Hexagon 682 Spectra 180
(Up to 32 MP camera / 16 MP dual)
LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5;
802.11ac/ad
Wave 2 (MU-MIMO);
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS
4 Q2 2018
Snapdragon
850[248]
(SDM850)
10 nm
(Samsung
10LPP)
Kryo 385 4 + 4 cores

(2.96 GHz + 1.77 GHz)

Adreno 630 710 MHz (727 GFLOPS in FP32) Hexagon 685 (3 TOPS) Spectra 280
(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)
LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ Q3 2018
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Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[249]
The Snapdragon 7c Gen 2 Compute Platform for Windows 10 PCs was announced on May 24, 2021.[250]
The Snapdragon 7c+ Gen 3 Compute Platform for Windows 10 / 11 PCs was announced on December 1, 2021.[251]

More information Product name (Model number), Fab ...
Product name
(Model number)
Fab CPU (ARMv8) GPU DSP ISP Memory
technology
Modem Connectivity Quick
Charge
Sampling
availability
Snapdragon 7c[252]
(SC7180)
8 nm
(Samsung
8LPP)
Kryo 468
2 + 6 cores
(2.4 GHz)
Adreno 618 825 MHz
(422.4 GFLOPS
in FP32)
Hexagon 692
(5 TOPS)
Spectra 255
(32 MP camera, 16 MP dual)
LPDDR4X
Dual-channel 16-bit (32-bit)
2133 MHz
(17.1 GB/s)
X15 LTE
download: Cat 15, @ 800 Mbit/s;
upload: Cat 13, @ 150 Mbit/s
Bluetooth 5;
802.11ax (Wi-Fi 6);
GPS, Glonass, SBAS, Beidou, Galileo, QZSS, NavIC;
USB 3.1; eMMC 5.1, UFS 3.0
Q1 2020
Snapdragon
7c Gen 2[253]
(SC7180P)
Kryo 468
2 + 6 cores
(2.55 GHz)
Q2 2021
Snapdragon
7c+ Gen 3
(SC7280)[254]
6 nm
(TSMC
N6)
Kryo 4 Gold +
4 Silver cores
(Cortex-A78 2.4 GHz +
Cortex-A55 1.8 GHz)
Hexagon
(6.5 TOPS)
Spectra
(64 MP single camera or
36+22 MP dual camera)
LPDDR4X
Dual-channel 16-bit (32-bit)
2133 MHz (17.1 GB/s) or
LPDDR5
Dual-channel 16-bit (32-bit)
3200 MHz (25.6 GB/s)
Internal:X53 5G/LTE (5G:
download @ 3.7 Gbit/s,
upload @ 2.9 Gbit/s;
LTE Cat 24/22:
download @ 1200 Mbit/s,
upload @ 210 Mbit/s)
FastConnect 6700,
Bluetooth 5.2;
802.11ax (Wi-Fi 6E)
2x2 (MU-MIMO) @ 3.6 Gbit/s;
GPS, Glonass, BeiDou, Galileo, QZSS, SBAS,
USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD
Q1 2022
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Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[249]

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(Model number)
Fab CPU (ARMv8) GPU DSP ISP Memory
technology
Modem Connectivity Quick
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Sampling
availability
Snapdragon 8c[255]
(SC8180)
7 nm
(TSMC
N7)
Kryo 490 4 + 4 cores
(2.45 GHz + 1.80 GHz)
Adreno 675
590 MHz
Hexagon 690
(9 TOPS)
Spectra 390
(192MP single camera or
22MP at 30fps dual camera with MFNR / ZSL)
LPDDR4X
Quad-channel
16-bit (64-bit)
2133 MHz (34.1 GB/s)
Internal: X24 LTE
(Cat 20: download @ 2 Gbit/s,
7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C.
upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM)

External: X55 5G/LTE[213]
(5G: download @ 7 Gbit/s, upload @ 3 Gbit/s;
LTE Cat 22:
download @ 2.5 Gbit/s, upload @ 316 Mbit/s)
Bluetooth 5.0;
802.11ac/ad;
GPS, Glonass, SBAS, Beidou, Galileo, QZSS;
USB 3.1; UFS 3.0, NVMe SSD
4+ Q1 2020
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Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.[256][257][258]
Notable features over the Snapdragon 855:

  • 10 MB total cache (L3 + SLC)
  • 8x 16-bit memory bus, (68.3 GB/s)
  • NVM Express 4x
  • 112.05 mm2 die size[259]

The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.[260]
The Snapdragon 8cx Gen 3 Compute Platform for Windows 10 / 11 PCs was announced on December 1, 2021.[251][261][262]

Notable features over the Snapdragon 888:

  • 8 MB L3 cache & 6 MB SLC (14 MB total cache)
  • 8x 16-bit memory bus, (68.3 GB/s)
  • NVM Express 4x
  • Built-in Microsoft Pluton TPM[263]
More information Product name (Model number), Fab ...
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(Model number)
Fab CPU (ARMv8) GPU DSP ISP Memory
technology
Modem Connectivity Quick
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Sampling
availability
Snapdragon
8cx
(SC8180X)[264]
7 nm
(TSMC
N7)
Kryo 495
4 + 4 cores
(2.84 GHz Cortex-A76
+ 1.80 GHz Cortex-A55)
Adreno 680
585 MHz
(1797.1
GFLOPS
in FP32)
Hexagon
690
(9 TOPS)
Spectra 390
(32MP single camera,
16MP at 30fps dual camera with MFNR / ZSL)[265]
LPDDR4X
Octa-channel
16-bit (128-bit)
2133 MHz
(68.3 GB/s)
No internal modem
Optional external X24 LTE (Cat 20:
download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C.
Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM)
Bluetooth 5.0;
802.11ac/ad;
GPS, Glonass, SBAS, Beidou, Galileo, QZSS;
USB 3.1; UFS 3.0, NVMe SSD
4+ Q3 2019
Snapdragon
8cx Gen 2 5G
(SC8180XP)[266]
Kryo 495
4 + 4 cores
(3.15 GHz Cortex-A76
+ 1.8 GHz Cortex-A55)
Adreno 690
660 MHz
(2027.5
GFLOPS
in FP32)
No internal modem

Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) or
X55 5G/LTE[213] (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s)
Bluetooth 5.1;
802.11ax (Wi-Fi 6)
2x2 (MU-MIMO) @ 2.4 Gbit/s,
NFC, GPS, Glonass, Beidou, Galileo, QZSS, SBAS,
USB 3.1; UFS 3.0. NVMe SSD
Q3 2020
Snapdragon
8cx Gen 3
(SC8280)[267]
5 nm
(Samsung
5LPE)
Kryo[261]
4 + 4 cores
(3.0 GHz Cortex-X1
+ 2.40 GHz Cortex-A78)
Adreno 695
900 MHz
(3686.4
GFLOPS
in FP32)
Hexagon[268]
(15 TOPS)
Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem
Optional external
X55 5G/LTE,
X62 5G/LTE, X65 5G/LTE
(5G: download @ 4.4/7.5/10 Gbit/s, upload @ 3 Gbit/s;
LTE Cat 22:
download @ 2.5 Gbit/s,
upload @ 316 Mbit/s)
FastConnect 6900,
Bluetooth 5.1;
802.11ax (Wi-Fi 6E)
2x2 (MU-MIMO) @ 3.6 Gbit/s;
GPS, Glonass, BeiDou, Galileo, QZSS, SBAS,
USB 3.1; UFS 3.1, NVMe SSD
Q1 2022
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Microsoft SQ compute platforms

The Microsoft SQ1 was announced on October 2, 2019.[269][270] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.[271]

More information Product name, Fab ...
Product name Fab CPU (ARMv8) GPU DSP ISP Memory
technology
Modem Connectivity Quick
Charge
Sampling
availability
Microsoft SQ1 7 nm
(TSMC
N7)
Kryo 495 4 + 4 cores

(3 GHz Cortex-A76 + 1.80 GHz Cortex-A55)

Adreno 685 590 MHz (1812.5 GFLOPs in FP32) Hexagon
690
(9 TOPS)
Spectra 390 (192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) No internal modem

Optional
external
X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C.
Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)
Bluetooth 5.0;
802.11ac/ad;
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS;
USB 3.1; UFS 3.0, NVMe SSD
4+ Q4 2019
Microsoft SQ2 Kryo 495 4 + 4 cores

(3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55)

Adreno
690
680 MHz
(2089 GFLOPs in FP32)
Q4 2020
Microsoft SQ3[272][273] 5 nm (Samsung 5LPE) Kryo 4 + 4 cores

(3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)

Adreno
695
900 MHz
(3686.4 GFLOPS in FP32)
Hexagon (15 TOPS)[274] Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem

Optional
external
X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22:
download up to 2.5 Gbit/s,
upload up to 316 Mbit/s)
FastConnect 6900,
Bluetooth 5.1;
802.11ac/ax
(Wi-Fi 6E) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB 3.1; UFS 3.1, NVMe SSD
Q3 2022
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Snapdragon X series

The Snapdragon X Elite for Windows 11 PCs was announced on October 24, 2023.[275]
The Snapdragon X Plus for Windows 11 PCs was announced on April 24, 2024.[276]
The Snapdragon X was announced on January 6, 2025.[277]

More information Product name (Model number), Fab ...
Product name
(Model number)
Fab Die
size
CPU (Cores/Freq) GPU DSP/NPU ISP Memory
technology
Modem Connectivity Sampling
availability
Snapdragon X[278]
X1-26-100 4 nm
(TSMC
N4)
Oryon 8 core (3.0 GHz) Adreno
X1-45
1107 MHz
(1.7 TFLOPS)
Hexagon (45 TOPS) Spectra (36 MP single camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)
No internal

External:
FastConnect 7800,
Bluetooth 5.4;
802.11ac/ax/be
(Wi-Fi 7) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB 4.0;
UFS 4.0, NVMe SSD
Q1 2025
Snapdragon X Plus[279][280]
X1P-42-100 4 nm
(TSMC
N4)
Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz) Adreno
X1-45
1107 MHz
(1.7 TFLOPS)
Hexagon (45 TOPS) Spectra (36 MP single camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)
No internal

External:
FastConnect 7800,
Bluetooth 5.4;
802.11ac/ax/be
(Wi-Fi 7) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB 4.0;
UFS 4.0, NVMe SSD
Q2 2024
X1P-46-100 Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz) Adreno
X1-45
(2.1 TFLOPS)
X1P-64-100 172.7
mm2
Oryon 10 core (3.4 GHz) Adreno
X1-85
1250 MHz
(3.8 TFLOPS)
Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100 Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
Snapdragon X Elite[281][280]
X1E-78-100 4 nm
(TSMC
N4)
172.7
mm2
Oryon 12 core (3.4 GHz) Adreno
X1-85
1250 MHz
(3.8 TFLOPS)
Hexagon (45 TOPS) Spectra (64 MP single camera / 36 MP dual camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)
No internal

External:
FastConnect 7800,
Bluetooth 5.4;
802.11ac/ax/be
(Wi-Fi 7) 2x2
(MU-MIMO) @ 3.6 Gbit/s;
GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS,
USB 4.0;
UFS 4.0, NVMe SSD
Q2 2024
X1E-80-100 Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100 Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz) Adreno
X1-85
1500 MHz
(4.6 TFLOPS)
X1E-00-1DE Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)
Close

Hardware codec supported

See: Qualcomm Hexagon

Wearable platforms

Summarize
Perspective

The Snapdragon Wear 1100 processor was announced May 30, 2016[282] for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1200 processor was announced June 27, 2017[283] for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.[284] It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018.[285] It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018.[286] The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.[287] The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.[288] The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

More information Model number, Product name ...
Model number Product name Fab CPU Co-processor GPU DSP Memory technology Modem Connectivity Sampling availability
 ? Wear 1100[289] 28 nm 1 core up to 1.2 GHz Cortex-A7 (ARMv7) Fixed Function GPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2016[290]
Wear 1200[291] 1 core up to 1.3 GHz Cortex-A7 (ARMv7) Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2017[292]
MSM8909w[293] Wear 2100[294] 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) Adreno 304 Hexagon LPDDR3 400 MHz X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 4.1[a]; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou Q1 2016[295]
Wear 2500[296] Q2 2018
Wear 3100[297] QCC1110 (1 core 50 MHz Cortex-M0)

3100 & 4100+ only

Q3 2018[298]
SDM429w Wear 4100 and 4100+[299] 12 nm + 28 nm 4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A) Adreno A504 320 MHz Hexagon QDSP6 V56 1x32 bit LPDDR3 750 MHz Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q2 2020[300]
SW5100 W5 and W5+ Gen 1[301] 4 nm + 22 nm 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55)

W5+ only

Adreno A702 1 GHz Hexagon DSP V66K 1x16 bit LPDDR4 2133 MHz Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q3 2022[302]
Close
  1. Bluetooth 4.2 for Wear 3100

Automotive platforms

The Snapdragon 602A,[303] for application in the motor industry,[304] was announced on January 6, 2014.
The Snapdragon 820A[305] was announced on January 6, 2016.

Snapdragon Automotive Cockpit platform
  • SA4150P
  • SA4155P
  • SA6145P
  • SA6150P
  • SA6155
  • SA6155P •
  • SA7255P
  • SA8145P
  • SA8150P
  • SA8155
  • SA8155P •
  • SA8195P •
  • SA8255P •
  • SA8295P •
Snapdragon Ride & Ride Flex platform
  • SA8540P
  • SA8620P
  • SA8650P
  • SA8770P
  • SA8775P
  • SA9000P • AI Accelerator
Snapdragon Cockpit Elite
  • Snapdragon Digital Chassis
Snapdragon Ride Elite
  • Qualcomm Oryon CPU
More information Product name (Model number), Fab ...
Product name
(Model number)
Fab CPU (Core / Freq) GPU DSP Memory
technology
Modem Connectivity Sampling
availability
Snapdragon
602A[306]
(APQ8064-AU)
28 nm
(TSMC
28LP)
Krait 300
4 cores
1.51 GHz
(ARMv7)
Adreno 320
400 MHz
(76.8 GFLOPs)
(2048x1536
+ 1080p
external
display)
Hexagon
QDSP6 V4
500 MHz
LPDDR3
Dual-channel
32-bit
533 MHz
(8.5 GB/s)
External: Gobi MDM9615
  • LTE: FDD/TDD Cat3
  • CDMA: EV-DOrB/rA 1x
  • UMTS: TD-SCDMA,
    DC-HSPA+/HSPA
  • GSM: EDGE/GPRS
Bluetooth 4.1 + BLE
Qualcomm VIVE
QCA6574
802.11ac (Wi-Fi 5)
2x2 (MU-MIMO)
Q1 2014
Snapdragon
820AM[307]
(APQ8096AU/
MSM8996AU)
14 nm
(Samsung
14LPP)
Kryo 2 + 2 cores
2.15 GHz Gold +
1.59 GHz Silver
(ARMv8)
Adreno 530
624 MHz
(319.4
GFLOPs)
Hexagon
680
1.0 GHz
LPDDR4X
Dual-channel
32-bit (64-bit)
1866 MHz
(29.9 GB/s)
Internal: APQ: no
MSM: X12 LTE
  • Download: Cat 12,
    600 Mbit/s
  • Upload: Cat 13,
    150 Mbit/s
Bluetooth 4.1
802.11ac (Wi-Fi 5)
IZat Gen8C
Q1 2016
SA6155P
[308][309]
11 nm
(Samsung
11LPP)
Kryo 460
2 + 6 cores
(2.0 GHz Gold +
1.6 GHz Silver)
Adreno
608/612
(110
GFLOPs)
Hexagon 685
V6 DSP,
Spectra 230 ISP
LPDDR4X
Dual-channel
16-bit (32-bit)
2133 MHz
(17.0 GB/s)
Internal:
no
Bluetooth 5.0
802.11ac (Wi-Fi 5)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
Q1 2019
Snapdragon
855A[310][311]
(SA8155P)
7 nm
(TSMC
N7)
Kryo 485
1 + 3 + 4 cores
2.96 GHz Prime
+ 2.42 GHz Gold
+ 1.79 GHz Silver
Adreno 640
675 MHz
(1036.8
GFLOPs)
Hexagon
690
(10 TOPS)
LPDDR4X
Quad-channel
16-bit (64-bit)
2133 MHz
(34.1 GB/s)[312]
X24 LTE Modem
  • FDD·TDD Cat.20
  • 2Gbps/316Mbps
    7·3CA / VoLTE,
  • 3G GSM, CDMA
    2000, TD-SCDMA,
  • 2G GSM/CDMA
Bluetooth 5.0
802.11ax (Wi-Fi 6)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
Q1 2021
SA8195P
[313][314]
Kryo 495
4 + 4 cores
Cortex-A76 +
Cortex-A55
Adreno 680
600 MHz
(1843.2
GFLOPs)
Hexagon LPDDR4X
Quad-channel
16-bit (64-bit)
2133 MHz
(34.1 GB/s)[315]
Internal:
no
Bluetooth 5.0
802.11ax (Wi-Fi 6)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
SA8255P 5 nm
(Samsung
5LPE)
Kryo 4 + 4 cores
2.35 GHz Prime
+ 2.35 GHz Gold
Adreno 663 Hexagon LPDDR5
Hexa-channel
16-bit (96-bit)
3200 MHz
(76.8 GB/s)
Bluetooth 5.2
802.11ax (Wi-Fi 6)
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
SA8295P Kryo 695
4 + 4 cores
2.56 GHz
Cortex-X1 +
2.05 GHz
Cortex-A78
Adreno 695 Hexagon
(30 TOPS)
LPDDR4X
Octa-channel
16-bit (128-bit)
2133 MHz
(68.2 GB/s)
Bluetooth 5.2
802.11ax (Wi-Fi 6)
2x2 (MU-MIMO)
@ 1.7 Gbit/s
GPS, Glonass, Beidou,
Galileo, QZSS, SBAS
2023
Close

Embedded platforms

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.[316][317]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.[318]

More information Product name (Model number), Fab ...
Product name
(Model number)
Fab CPU
(Cores/Freq)
GPU DSP ISP Memory
technology
Modem Connectivity Sampling
availability
Snapdragon
410E[319]
(APQ8016E)
28 nm
(TSMC
28LP)
4 cores up to 1.2 GHz
Cortex-A53
(ARMv8)
Adreno 306 Hexagon
QDSP6 V5
691 MHz
Up to 13 MP camera LPDDR2/3
Single-channel
32-bit 533 MHz
(4.2 GB/s)
none Bluetooth 4.0,
802.11n, GPS
Snapdragon
600E[320]
(APQ8064E)
4 cores up to 1.5 GHz
Krait 300
(ARMv7)
Adreno 320
400 MHz
Hexagon QDSP6 V4 500 MHz Up to
21 MP
camera
DDR3/DDR3L
Dual-channel
533 MHz
Bluetooth 4.0,
802.11a/b/g/n/ac
(2.4/5 GHz),
IZat Gen8A
Snapdragon
800E[321]
(APQ8074)
28 nm
(TSMC
28HPM)
4 cores up to 2.3 GHz
Krait 400
(ARMv7)
Adreno 330 Hexagon
QDSP6 V5
Up to
55 MP
camera
LPDDR3
Dual-channel
32-bit
800 MHz
(12.8 GB/s)
Bluetooth 4.1;
802.11n/ac
(2.4/5 GHz);
IZat Gen8B; NFC,
Gigabit Ethernet,
HDMI,
DisplayPort,
SATA, SDIO,
UART, I2C,
GPIOs, JTAG;
USB 3.0/2.0
Snapdragon
810E[322]
(APQ8094)
20 nm
(TSMC
20SoC)
4 + 4 cores
2.0 GHz
Cortex-A57
+ 1.55 GHz
Cortex-A53
(ARMv8)
Adreno 430
650 MHz
Hexagon
V56
800 MHz
Up to
55 MP
camera
LPDDR4
Dual-channel
32-bit
1600 MHz
(25.6 GB/s)
Bluetooth 4.1;
802.11ac;
IZat Gen8C
Snapdragon
820E[323]
(APQ8096)
14 nm
FinFET
(Samsung
14LPP)
2 + 2 cores
(2.15 GHz + 1.6 GHz)
Kryo
(ARMv8)
Adreno 530 Hexagon
680
825 MHz
Up to
28 MP
camera
LPDDR4
Quad-channel
16-bit (64-bit)
1866 MHz
(29.8 GB/s)
Bluetooth 4.1;
802.11ac/ad;
IZat Gen8C
Close

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform[324] was announced on April 11, 2018.[325][326] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

More information Model number, Fab ...
Model number Fab CPU (ARMv8) GPU DSP ISP Memory
technology
Modem Connectivity Quick
Charge
Sampling
availability
QCS603[327] 10 nm (Samsung 10LPP) 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) Adreno 615 (Quad HD + 4K Ultra HD external display) Hexagon 685 Spectra 270 (Up to 24 MP camera / 16 MP dual) LPDDR4X 16-bit 1866 MHz none Bluetooth 5.0, NFC, 802.11ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+
QCS605[328] 8 cores up to 2.5 GHz Kryo 300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0, NFC, 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1
Close

Home Hub and Smart Audio platforms

Summarize
Perspective

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)[329] was announced on June 14, 2017.[330]
The Qualcomm 212 Home Hub (APQ8009)[331] and Qualcomm 624 Home Hub (APQ8053)[332] were announced on January 9, 2018.[333]

The QCS400 Series was announced March 19, 2019.[334]

More information Model number, Fab ...
Model number Fab CPU (Cores/Freq) GPU DSP ISP Audio Memory
technology
Modem Connectivity Sampling
availability
APQ8009[335][329]
(SDA212)[336]
28 nm (TSMC 28LP) 4 cores up to 1.3 GHz
Cortex-A7 (ARMv7)
Adreno 304 (HD) Hexagon 536 Up to 16 MP camera LPDDR2/3 Single-channel 533 MHz none Bluetooth 4.2 + BLE, 802.11ac (2.4/5GHz) Wi-Fi
APQ8017[329] 4 cores up to 1.4 GHz
Cortex-A53 (ARMv8)
Adreno 308 (Full HD) LPDDR3 Single-channel 667 MHz
APQ8053[337]
(SDA624)[338]
14 nm (Samsung 14LPP) 8 cores up to 1.8 GHz
Cortex-A53 (ARMv8)
Adreno 506 (Full HD+) Hexagon 546 Up to 24 MP camera, 13 MP dual LPDDR3
QCS403[339] Dual-core CPU none 2x Hexagon V66 12× audio channels supported Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 Q1 2019
QCS404[340] Quad-core CPU
QCS405[341] Adreno 306 (Full HD+)
QCS407[342] 32× audio channels supported
Close

Mixed Reality (MR) platforms

Snapdragon XR series

It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
  • Snapdragon XR2+ Gen 1 was announced on October 11, 2022,[346] and is used in the Meta Quest Pro.
  • Snapdragon XR2 Gen 2 is announced in September 2023.[347] Qualcomm claims improved performance compared to its predecessor XR2 5G.
The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.[348]
It supports Wi-Fi 7 network. It is integrated into Meta Quest 3.
More information Product name, Fab ...
Product name Fab Die
size
CPU (ARMv8) GPU DSP ISP Memory
technology
Tracking Connectivity Sampling
availability
XR1[350] 10 nm
(Samsung
10LPP)
4x Kryo 385 Gold +
4x Kryo 385 Silver
Adreno 615 Hexagon 685 Spectra LPDDR4X 3DoF and 6DoF
head and controller tracking
Wi-Fi 5
Bluetooth 5
Q1 2019
XR2[351] 7 nm
(TSMC
N7+)
1x Kryo 585 Prime (2.84 GHz) +
3x Kryo 585 Gold (2.42 GHz) +
4x Kryo 585 Silver (1.80 GHz)
Adreno 650
(up to 2x 3K displays
at 90 Hz)
Hexagon 698 Spectra
(input from
up to 7 cameras)
Full 6DoF head and controller tracking,
as well as hand and finger tracking
Wi-Fi 6
Bluetooth 5
5G
Q1 2020
XR2+ Gen 1[352] LPDDR5 Wi-Fi 6E
Bluetooth 5.2
5G
Q4 2022
XR2 Gen 2[353] 4 nm
(Samsung
4LPX)[354]
115.8 mm2 4x Kryo (Cortex-A78C 2.36 GHz) +
2x Kryo (Cortex-A78C 2.05GHz)
Adreno 740
(up to 2x 3K displays
at 90 Hz)
Hexagon Spectra
(input from
up to 10 cameras)
LPDDR5X
Quad-channel 16-bit (64-bit)
Wi-Fi 7
Bluetooth 5.3
5G
Q4 2023
XR2+ Gen 2[355] 4x Kryo (Cortex-A78C) +
2x Kryo (Cortex-A78C)
Adreno 740
(up to 2x 4.3K displays
at 90 Hz)
Hexagon Spectra
(input from
up to 12 cameras)
Q1 2024
Close

Snapdragon AR series

The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022.[356] It is intended for use in smart glasses.[357]
On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses.[347] It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

Gaming platforms

Summarize
Perspective

Snapdragon G series

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.[358][359]

The Razer Edge is the first device to use the platform.[360]

The G3x Gen 1 is based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters

with higher clock speeds, and the same GPU with a higher clockspeed. Connectivity options also seem in line.[361]

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.[362]

On March 19, 2025, Qualcomm revealed the Snapdragon G3 Gen 3, G2 Gen 2, and G1 Gen 2 platforms.[363]

More information Product name, Fab ...
Product name Fab CPU (Cores/Freq) GPU Modem Connectivity Display Sampling
availability
G1 Gen 1[364] Un­known Kryo (8 core) Adreno A11 Bluetooth 5.0;
802.11a/b/g/n/ac (Wi-Fi 5)
1x1
HD at
60 fps
Q4 2023
G1 Gen 2[365] 4 nm
(Samsung 4LPX)
2 + 6 cores
(2x 2.4 GHz Kryo GoldCortex-A78
+ 6x 1.96 GHz Kryo SilverCortex-A55)
Adreno A12 X61 5G
(5G NR Sub-6 & mmWave:
download up to 2.5 Gbit/s,
upload up to 900 Mbit/s)
Bluetooth 5.1;
802.11a/b/g/n/ac (Wi-Fi 5)
1x1
FHD+ up to
120 fps
Q1 2025
G2 Gen 1[366] Kryo
4 + 4 cores
(Cortex-A78
+ Cortex-A55)
Adreno A21 X62 5G/LTE
(5G NR Sub-6 & mmWave:
download up to 4.4 Gbit/s,
upload up to 1.6 Gbit/s)
FastConnect 6700;
Bluetooth 5.0;
802.11a/b/g/n/ac/ax (Wi-Fi 6E)
2x2 (MU-MIMO)
up to 2.9 Gbit/s;
FHD+ up to
144 fps
Q4 2023
G2 Gen 2[367] 4 nm
(TSMC N4P)
Kryo
(Cortex-X4
+ Cortex-A720
+ Cortex-A520)
Adreno A22 X61 5G
(5G NR Sub-6 & mmWave:
download up to 2.5 Gbit/s,
upload up to 900 Mbit/s)
FastConnect 7800;
Bluetooth 5.3;
802.11a/b/g/n/ac/ax/be (Wi-Fi 7)
up to 5.8 Gbit/s
QHD+ up to
144 fps
Q1 2025
G3x Gen 1[368] 5 nm
(Samsung 5LPE)
1x 3.0 GHz
Kryo 680 Prime (Cortex-X1) +
3x 2.42 GHz
Kryo 680 Gold (Cortex-A78) +
4x 1.80 GHz
Kryo 680 Silver Cortex-A55)
Adreno 660
900 MHz
(1382.4 GFLOPs
in FP32)
X60 5G
(5G NR Sub-6 & mmWave:
download up to 7.5 Gbit/s,
upload up to 3 Gbit/s;
LTE Cat 22:
download up to 2.5 Gbit/s,
upload up to 0.316 Gbit/s)
FastConnect 6900;
Bluetooth 5.2;
802.11a/b/g/n/ac/ax (Wi-Fi 6E)
up to 3.6 Gbit/s
FHD+ up to
144 fps
Q1 2023
G3x Gen 2[369][370] 4 nm
(TSMC N4)
1× 3.36 GHz
Kryo Prime (Cortex-X3)
+ 4× 2.8 GHz
Kryo Gold (2× Cortex-A715
Cortex-A710)
+ 3× 2.02 GHz
Kryo Silver (Cortex-A510)
Adreno A32
1000 MHz
(3072 GFLOPS
in FP32)
X70 5G
(5G NR Sub-6 & mmWave:
download up to 10 Gbit/s,
upload up to 3.5 Gbit/s)
FastConnect 7800;
Bluetooth 5.3;
802.11a/b/g/n/ac/ax/be (Wi-Fi 7)
up to 5.8 Gbit/s
Q4 2023
G3 Gen 3[371] 4 nm
(TSMC N4P)
1× (Cortex-X4)
+ 5× (Cortex-A720)
+ 2× (Cortex-A520)
Adreno A33 X61 5G
(5G NR Sub-6 & mmWave:
download up to 2.5 Gbit/s,
upload up to 900 Mbit/s)
QHD+ up to
144 fps
Q1 2025
Close

Bluetooth SoC platforms

Summarize
Perspective

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.[372][373] Qualcomm announced the QCC5100 Series at CES 2018.[374]

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.[375][376] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.[377] On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.[378][379]

Qualcomm QCC300x Series Bluetooth audio SoCs

More information Model number, Fab ...
Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Sampling availability
QCC3001[380] RISC application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP (Up to 80 MHz) Bluetooth 5.0

Dual-mode Bluetooth

TrueWireless Stereo

cVc audio

Mono / 2-mic
QCC3002[381] TrueWireless Stereo

aptX Classic/HD/LL

cVc audio

QCC3003[382] cVc audio Stereo / 1-mic
QCC3004[383] Stereo / 2-mic
QCC3005[384] aptX Classic/HD/LL

cVc audio

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Qualcomm QCC30xx Series Bluetooth audio SoCs

More information Model number, Fab ...
Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Digital assistant activation Sampling availability
QCC3020[385] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

~6mA (2DP streaming) Mono / 2-mic Button press H1 2017
QCC3021[386] Stereo / 1-mic
QCC3024[387] cVc audio

Google Fast Pair

Stereo / 2-mic
QCC3026[388] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Mono / 2-mic
QCC3031[389] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Stereo / 1-mic
QCC3034[390] aptX Classic/HD/LL

cVc audio

Google Fast Pair

Mono / 2-mic
QCC3040[391] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[375][376] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth speed: 2 Mbit/s

aptX Classic/HD

TrueWireless mirroring

ANC (Feedforward/feedback and hybrid)

cVc audio

Google Fast Pair

<5 mA Stereo / 2-mic Button press H1 2020
QCC3046[392] <5 mA
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Qualcomm QCC510x Series Bluetooth audio SoCs

More information Model number, Fab ...
Model number Fab CPU DSP Bluetooth Technologies support Power consumption Digital assistant activation Sampling availability
QCC5120[393] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback and Hybrid)

cVc audio

Google Fast Pair

~6mA (2DP streaming)

~7mA HFP Narrow Band, 1 Digital MIC cVc

Button press

Qualcomm Voice Activation

H1 2018
QCC5121[394]
QCC5124[395]
QCC5125[396] Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~10mA (2DP streaming)

~10mA HFP Narrow Band, 1 Digital MIC cVc

Button press
QCC5141[397] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[375][376] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Speed: 2 Mbit/s

aptX Adaptive

eXtension program

TrueWireless Mirroring

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~5mA A2DP stream Button press

Qualcomm Voice Activation

H1 2020
QCC5144[398]
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See also

References

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