LGA 4677
CPU socket designed by Intel From Wikipedia, the free encyclopedia
LGA 4677 (Socket E) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023.[1][2][3]
| Release date | January 10, 2023 |
|---|---|
| Designed by | Intel |
| Manufactured by | Lotes |
| Type | LGA-ZIF |
| Chip form factors | Flip-chip |
| Contacts | 4677 |
| FSB protocol | PCI Express Direct Media Interface Ultra Path Interconnect |
| FSB frequency | 16 GT/s to 20 GT/s UPI |
| Processor dimensions | 77.5 mm x 56.5 mm |
| Processors | |
| Predecessor | LGA 4189 |
| Successor | LGA 4710 LGA 7529 |
| Memory support | DDR5 with ECC support |
This article is part of the CPU socket series | |
Features
- Support for PCI Express 5.0[4] and Direct Media Interface 4.0
- Supports 8 channels of DDR5 RAM with error correction code support
- Intel Smart Sound Technology that provides dedicated audio voice processing to support voice wake functions is currently available only on the W790 chipset.[5]
Chipsets
Summarize
Perspective
| Chipset | ||||
|---|---|---|---|---|
| C741 | W790 | |||
| Release date | January 2023 | March 2023 | ||
| Price (USD) | $70 | $72 | ||
| Overclocking | No | Yes | ||
| Bus interface | DMI 4.0 x8 | DMI 4.0 x8 | ||
| CPU support | Sapphire Rapids-SP Emerald Rapids-SP |
Sapphire Rapids-WS Sapphire Rapids-64L Sapphire Rapids-112L | ||
| Socket count | 1s or 2S | 1S | ||
| Memory capacity |
Up to 4 TB with one CPU or 8 TB with two CPUs | Up to 2 TB (on W-2400 models) Up to 4 TB (on W-3400 models) | ||
| Maximum DIMM slots |
16 (1 CPU)
32 (2 CPUs) |
8 (W-2400) 16 (W-3400) | ||
| Maximum USB 2.0 ports |
14 | |||
| USB 3.2 ports configuration |
Gen 1 (5 Gbit/s) |
10 | 10 | |
| Gen 2 |
x1 (10 Gbit/s) |
? | 10 | |
| x2 (20 Gbit/s) |
? | 5 | ||
| Maximum SATA 3.0 ports |
20 | 8 | ||
| Processor PCI Express configuration |
5.0 | Up to 80 lanes | Up to 112 lanes | |
| 4.0 | — | |||
| PCH PCI Express configuration |
4.0 | — | 16 | |
| 3.0 | 20 | 12 | ||
| Independent display support (digital ports/pipes) |
? | |||
| Wireless | Integrated | No | Intel Wi-Fi 6E AX211 (Garfield Peak 2) | |
| Discrete | Intel Wi-Fi 6E AX211 (Typhoon Peak 2) | |||
| PCIe RAID support |
? | |||
| SATA RAID support | ||||
| Intel Optane Memory support | ||||
| Intel Smart Sound Technology |
No | Yes | ||
| Intel Active Management, Trusted Execution and vPro Technology |
Yes | |||
| Chipset TDP |
11 W | 6 W | ||
| Chipset package size |
22 mm × 23 mm 506 mm2 |
28 mm × 25 mm 700 mm2 | ||
See also
References
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