HiSilicon

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,^[2][3] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.^[4][5] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.

HiSilicon Co., Ltd.

Native name	海思半导体有限公司；上海海思
Company type	Subsidiary
Industry	Fabless semiconductors, Semiconductors, Integrated circuit design
Founded	1991; 33 years ago (1991)[1][citation needed]
Headquarters	Shenzhen, Guangdong, China
Products	SoCs
Brands	Kirin Gigahom Kunpeng Balong Ascend
Parent	Huawei
Website	www.hisilicon.com

HiSilicon
Simplified Chinese	海思半导体有限公司
Traditional Chinese	海思半導體有限公司
Literal meaning	Haisi Semiconductor Limited Company
Transcriptions Standard Mandarin Hanyu Pinyin Hǎisī Bàndǎotǐ Yǒuxiàn Gōngsī

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.^[6] In 2020, the United States instituted rules that require any American firms providing equipment to HiSilicon or non-American firms who use American technologies or IPR (such as TSMC) that supply HiSilicon to have licenses^[7] as part of the ongoing trade dispute, and Huawei announced it will stop producing its Kirin chipsets from 15 September 2020 onwards^[8] due to this disruption of its supply chain. On August 29, 2023, Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, which is used on its latest Mate 60 Pro phablet series of phones and MatePad 13.2 tablets.

History

HiSilicon was Huawei's ASIC design center, which was founded in 1991.

• 2004– Shenzhen HiSilicon Semiconductor Co., Ltd. was registered and the company was formally established.
• 2016– HiSilicon's Kirin 960 chipset was rated one of the "best of Android 2016" in performance by Android Authority.^[9]
• 2019– Shanghai HiSilicon, a wholly-owned subsidiary of Huawei, was established.^[10]

Smartphone application processors

HiSilicon Hi6250

HiSilicon develops SoCs based on the ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

K3V2

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones^[11] and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.^[12] The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
K3V2 (Hi3620)	40 nm	ARMv7	Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB	4	1.4	Vivante GC4000	240 MHz (15.3GFlops)	LPDDR2	64-bit dual-channel	7.2 (up to 8.5)	—	—	—	—	Q1 2012	List Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6, Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S))

K3V2E

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
K3V2E (Hi3620)	40 nm	ARMv7	Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB	4	1.5	Vivante GC4000	240 MHz (15.3GFlops)	LPDDR2	64-bit dual-channel	7.2 (up to 8.5)	—	—	—	—	2013	List Huawei Honor 3

Kirin 620

• supports – USB 2.0 / 13 MP / 1080p video encode

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 620 (Hi6220)[13]	28 nm	ARMv8-A	Cortex-A53	8[14]	1.2	Mali-450 MP4	500 MHz (32GFlops)	LPDDR3 (800 MHz)	32-bit single-channel	6.4	—	Dual SIM LTE Cat.4 (150 Mbit/s)	—	—	Q1 2015	List Huawei P8 Lite, Honor 4X, Honor 4C, Huawei G Play Mini, Honor Holly 3, Y6ll, 96Boards HiKey

Kirin 650, 655, 658, 659

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 650 (Hi6250)	16 nm FinFET+	ARMv8-A	Cortex-A53 Cortex-A53	4+4	2.0 (4xA53) 1.7 (4xA53)	Mali-T830 MP2	900 MHz (40.8GFlops)	LPDDR3 (933 MHz)	64-bit dual-channel (2x32bit)[15]		A-GPS, GLONASS	Dual SIM LTE Cat.6 (300 Mbit/s)	802.11 b/g/n	Bluetooth v4.1	Q2 2016	List Huawei P9 Lite, Honor 5C
Kirin 655					2.12 (4xA53) 1.7 (4xA53)										Q4 2016	List Huawei Mate9 Lite, Huawei Honor 6X, P8 Lite (2017), Honor 8 Lite
Kirin 658					2.35 (4xA53) 1.7 (4xA53)								802.11 b/g/n/ac		Q2 2017	List P10 Lite

Kirin 710

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 710 (Hi6260)	TSMC 12 nm FinFET	ARMv8-A	Cortex-A73 Cortex-A53	4+4	2.2 (A73) 1.7 (A53)	Mali-G51 MP4	1000 MHz (64 GFLOPS in FP32)	LPDDR3 LPDDR4	32-bit		A-GPS, GLONASS	Dual SIM LTE Cat.12 (600 Mbit/s)	802.11 b/g/n	Bluetooth v4.2	Q3 2018	List Huawei Nova 3i, Honor 10 Lite, Huawei P Smart+, Huawei P Smart 2019, Huawei Mate 20 Lite, Honor 8X, Huawei Y9 (2019), Huawei P30 Lite，Huawei Y9 Prime 2019, Huawei Y9s, Huawei Mate 20 Lite, Honor 20i
Kirin 710F[16]																List Honor 9X, Huawei P40 lite E, Huawei Y8p
Kirin 710A	SMIC 14 nm FinFET[17]				2.0 (A73) 1.7 (A53)											List Honor Play 4T, Huawei P smart 2021, Huawei Nova Y70, Huawei Nova Y71, Huawei Nova Y72, Huawei MatePad SE 11

Kirin 810 and 820

• DaVinci NPU based on Tensor Arithmetic Unit
• Kirin 820 supported 5G NSA & SA

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 810 (Hi6280)	7 nm FinFET	ARMv8.2-A	Cortex-A76 Cortex-A55 DynamIQ	2+6	2.27 (2xA76) 1.9 (6xA55)	Mali-G52 MP6	820 MHz (157.4 GFLOPS in FP32)	LPDDR4X (2133 MHz)	64-bit (16-bit quad-channel)	31.78	A-GPS, GLONASS, BDS	Dual SIM LTE Cat.12 (600 Mbit/s)	802.11 b/g/n/ac	Bluetooth v5.0	Q2 2019	List Huawei Nova 5 Huawei Honor 9x Huawei Honor 9x Pro Huawei Mate 30 Lite Huawei P40 Lite Huawei Nova 7i Huawei nova 6 SE Huawei P smart Pro 2019 Huawei nova 5z Huawei nova 5i Pro Huawei Honor 20S Huawei MatePad 10.4
Kirin 820 5G				(1+3)+4	2.36 (1xA76 H) 2.22 (3xA76 L) 1.84 (4xA55)	Mali-G57 MP6						Balong 5000 (Sub-6 GHz Only; NSA & SA)			Q1 2020	List Honor 30S Honor X10 5G
Kirin 820E 5G				3+3	2.22 (4xA76 L) 1.84 (4xA55)	Mali-G57 MP6						Balong 5000 (Sub-6 GHz Only; NSA & SA)			Q1 2021

Kirin 8000

HiSilicon Kirin 8000 is a mid-range Kirin 8 series chip not officially announced, however, it was released along with the announcement of Huawei nova 12.^[18]

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 8000	SMIC N+2  7 nm FinFET	ARMv8.2-A	Cortex-A77 Cortex-A77 Cortex-A55 DynamIQ	1+3+4	2.40 (1xA77 H) 2.19 (3xA77 L) 1.84 (4xA55)	Mali-G610 MP4	864 MHz	LPDDR5 (3200 MHz)	64-bit (16-bit quad-channel)	51.2	GPS, A-GPS, GLONASS, BeiDou, Galileo, QZSS	Balong modem	Wi-Fi 6 (11ax)	Bluetooth v5.2	Q2 2019	List Huawei Nova 12 Huawei Nova 12 Pro Huawei Nova Flip

Kirin 910 and 910T

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 910 (Hi6620)	28 nm HPM	ARMv7	Cortex-A9	4	1.6	Mali-450 MP4	533 MHz (32GFlops)	LPDDR3	32-bit single-channel	6.4	—	LTE Cat.4	—	—	H1 2014	List HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1,[19] Huawei P6 S,[20] Huawei MediaPad M1,[21] Huawei Honor 3C 4G
Kirin 910T					1.8		700 MHz (41.8GFlops)				—		—	—	H1 2014	List Huawei Ascend P7

Kirin 920, 925 and 928

• The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 920	28 nm HPM	ARMv7	Cortex-A15 Cortex-A7 big.LITTLE	4+4	1.7 (A15) 1.3 (A7)	Mali-T628 MP4	600 MHz (76.8GFlops)	LPDDR3 (1600 MHz)	64-bit dual-channel	12.8	—	LTE Cat.6 (300 Mbit/s)	—	—	H2 2014	List Huawei Honor 6[22]
Kirin 925 (Hi3630)					1.8 (A15) 1.3 (A7)						—		—	—	Q3 2014	List Huawei Ascend Mate7 Huawei Honor 6 Plus
Kirin 928					2.0 (A15) 1.3 (A7)		—				—		—	—		List Huawei Honor6 extreme Edition

Kirin 930 and 935

• supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 930 (Hi3635)	28 nm HPC	ARMv8-A	Cortex-A53 Cortex-A53	4+4	2.0 (A53) 1.5 (A53)	Mali-T628 MP4	600 MHz (76.8GFlops)	LPDDR3 (1600 MHz)	64-bit(2x32-bit) Dual-channel	12.8 GB/s	—	Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s)	—	—	Q1 2015	List Huawei MediaPad X2, Huawei P8, Huawei MediaPad M2,
Kirin 935					2.2 (A53) 1.5 (A53)		680 MHz (87GFlops)				—		—	—	Q1 2015	List Huawei P8 MAX, Honor 7, Huawei Mate S

Kirin 950 and 955

• supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 950 (Hi3650)	TSMC 16 nm FinFET+[23]	ARMv8-A	Cortex-A72 Cortex-A53 big.LITTLE	4+4	2.3 (A72) 1.8 (A53)	Mali-T880 MP4	900 MHz (168 GFLOPS FP32)	LPDDR4	64-bit(2x32-bit) Dual-channel	25.6	—	Dual SIM LTE Cat.6	—	—	Q4 2015	List Huawei Mate 8, Huawei Honor V8 32 GB, Huawei Honor 8, Huawei Honor Magic, Huawei MediaPad M3 (BTV-W09)[24]
Kirin 955[25]					2.5 (A72) 1.8 (A53)			LPDDR3 (3 GB) LPDDR4 (4 GB)			—		—	—	Q2 2016	List Huawei P9, Huawei P9 Plus, Honor Note 8, Honor V8 64 GB

Kirin 960

• Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 960 (Hi3660)[26]	TSMC 16 nm FFC	ARMv8-A	Cortex-A73 Cortex-A53 big.LITTLE	4+4	2.36 (A73) 1.84 (A53)	Mali-G71 MP8	1037 MHz (199.1 GFLOPS in FP32)	LPDDR4-1600	64-bit(2x32-bit) Dual-channel	28.8	—	Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO	—	—	Q4 2016	List Huawei Mate 9, Huawei Mate 9 Porsche Design, Huawei Mate 9 Pro, Huawei P10, Huawei P10 Plus, Huawei Nova 2s, Honor 8 Pro (Honor V9), Honor 9, Huawei MediaPad M5

Kirin 970

• Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7
• Cadence Tensilica Vision P6 DSP.^[27]
• NPU made in collaboration with Cambricon Technologies. 1.92T FP16 OPS.^[28]

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 970 (Hi3670)	TSMC 10 nm FinFET+	ARMv8-A	Cortex-A73 Cortex-A53 big.LITTLE	4+4	2.36 (A73) 1.84 (A53)	Mali-G72 MP12	746 MHz (214.8 GFLOPS in FP32)	LPDDR4X-1866	64-bit(4x16-bit) Quad-channel	29.8	Galileo	Dual SIM LTE Cat.18 LTE 5x CA, No 4x4 MIMO	—	—	Q4 2017	List Huawei Nova 3 Huawei P20 Huawei P20 Pro Huawei Mate 10 Huawei Mate 10 Pro Huawei Mate 10 Porsche Design Huawei Mate RS Porsche Design Honor V10/ Honor View 10 Honor 10 Honor Note 10 Honor Play

Kirin 980 and Kirin 985 5G/4G

Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology.

• Interconnect: ARM Mali G76-MP10, Storage: UFS 2.1, Sensor Hub: i8
• Dual NPU made in collaboration with Cambricon Technologies.

Kirin 985 5G is the second Hisilicon's 5G SoC based on 7 nm FinFET Technology.

• Interconnect: ARM Mali-G77 MP8, Storage UFS 3.0
• Big-Tiny Da Vinci NPU: 1x Da Vinci Lite + 1x Da Vinci Tiny

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 980	TSMC 7 nm FinFET	ARMv8.2-A	Cortex-A76 Cortex-A55 DynamIQ	(2+2)+4	2.6 (A76 H) 1.92 (A76 L) 1.8 (A55)	Mali-G76 MP10	720 MHz (345.6 GFLOPS in FP32)[29]	LPDDR4X-2133	64-bit(4x16-bit) Quad-channel	34.1	Galileo	Dual SIM LTE Cat.21 LTE 5x CA, No 4x4 MIMO	—	—	Q4 2018	List Huawei Mate 20 Huawei Mate 20 Pro Huawei Mate 20 RS Porsche Design Huawei Mate 20 X Honor Magic 2 Honor View 20/V20 Honor 20 Honor 20 Pro Huawei P30 Huawei P30 Pro Huawei Nova 5 Pro Huawei MediaPad M6 Huawei Nova 5T
Kirin 985 5G/4G (Hi6290)				(1+3)+4	2.58 (A76 H) 2.40 (A76 L) 1.84 (A55)	Mali-G77 MP8	700 MHz (358.4 GFLOPS in FP32)					Balong 5000 (Sub-6 GHz only; NSA & SA), 4G version available	—	—	Q2 2020	List Honor 30 Honor V6 Huawei nova 7 5G Huawei nova 7 Pro 5G Huawei nova 8 5G Huawei nova 8 Pro 5G

Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G

Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology.^[30]

• Interconnect
  • Kirin 990 4G: ARM Mali-G76 MP16
  • Kirin 990 5G: ARM Mali-G76 MP16
  • Kirin 990E 5G: ARM Mali-G76 MP14
• Da Vinci NPU.
  • Kirin 990 4G: 1x Da Vinci Lite + 1x Da Vinci Tiny
  • Kirin 990 5G: 2x Da Vinci Lite + 1x Da Vinci Tiny
  • Kirin 990E 5G: 1x Da Vinci Lite + 1x Da Vinci Tiny
• Da Vinci Lite features 3D Cube Tensor Computing Engine (2048 FP16 MACs + 4096 INT8 MACs), Vector unit (1024bit INT8/FP16/FP32)
• Da Vinci Tiny features 3D Cube Tensor Computing Engine (256 FP16 MACs + 512 INT8 MACs), Vector unit (256bit INT8/FP16/FP32)^[31]

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 990 4G	TSMC 7 nm FinFET (DUV)	ARMv8.2-A	Cortex-A76 Cortex-A55 DynamIQ	(2+2)+4	2.86 (A76 H) 2.09 (A76 L) 1.86 (A55)	Mali-G76 MP16	600 MHz (460.8 GFLOPS in FP32)	LPDDR4X-2133	64-bit(4x16-bit) Quad-channel	34.1	Beidou, Galileo, GLONASS	Balong 765 (LTE Cat.19)	—	—	Q4 2019	List Huawei Mate 30 Huawei Mate 30 Pro Huawei P40 4G Huawei Nova 6 Huawei Nova 6 5G Honor V30 Honor Play4 Pro Huawei MatePad Pro (WiFi/4G) (2019–2020)
Kirin 990 5G	TSMC 7 nm+ FinFET (EUV)				2.86 (A76 H) 2.36 (A76 L) 1.95 (A55)							Balong 5000 (Sub-6-GHz only; NSA & SA)	—	—		List Huawei Mate 30 5G Huawei Mate 30 Pro 5G Huawei Mate 30 RS Porche Design Huawei P40 Huawei P40 Pro Huawei P40 Pro+ Honor V30 Pro Huawei MatePad Pro 5G (2020) Honor 30 Pro Honor 30 Pro+
Kirin 990E 5G	Mali-G76 MP14					600 MHz (403.2 GFLOPS in FP32)	—						—	Q4 2020	List Huawei Mate 30E Pro 5G Huawei Mate 40E (4G/5G)

Kirin 9000 5G/4G and Kirin 9000E, Kirin 9000L

Kirin 9000 is HiSilicon's first SoC based on 5 nm+ FinFET (EUV) TSMC technology (N5 node) and the first 5 nm SoC to be launched on the international market.^[32] This octa-core system on a chip is based on the 9th Gen of the HiSilicon Kirin series and is equipped with 15.3 billion transistors in a 1+3+4 core configuration: 4 Arm Cortex-A77 CPU (1x 3.13 GHz and 3x 2.54 GHz), 4 Arm Cortex-A55 (4x 2.05 GHz) and a 24-core Mali-G78 GPU (22-core in the Kirin 9000E version) The Kirin 9000L uses a 1+2+3 core configuration: 3 Arm Cortex-A77 (1x 3.13 GHz and 2x 2.54 GHz), 3 Arm Cortex-A55 (3x 2.05 GHz) and a 22-core Mali-G78 GPU with Kirin Gaming+ 3.0 implementation.^[32]

The integrated quad pipeline NPU (Dual Big Core + 1 Tiny Core configuration) is equipped with the Kirin ISP 6.0 to support advanced computational photography. The Huawei Da Vinci Architecture 2.0 for AI supports 2x Ascend Lite + 1x Ascend Tiny (only 1 Lite in 9000E/L). The system cache is 8 MB and the SoC works with the new LPDDR5/4X memories (made by Samsung in the Huawei Mate 40 series). Due to the integrated 3rd generation 5G proprietary modem "Balong 5000", Kirin 9000 supports 2G, 3G, 4G and 5G SA & NSA Sub-6 GHz connectivity.^[32] The SoC's TDP is 6W.

The 2021 4G version of the Kirin 9000 has the Balong modem limited via software to comply with the ban imposed on Huawei by the US government for non-chinese 5G technologies. The Kirin 9006C is a rebranded variant of the Kirin 9000E for the Huawei Qingyun L420 and L540 laptops.^[33][34]

• GPU
  • Kirin 9000L: ARM Mali-G78 MP22
  • Kirin 9000E: ARM Mali-G78 MP22
  • Kirin 9000: ARM Mali-G78 MP24
• Da Vinci NPU architecture 2.0
  • Kirin 9000L: 1x Big Core + 1x Tiny Core
  • Kirin 9000E: 1x Big Core + 1x Tiny Core
  • Kirin 9000: 2x Big Cores + 1x Tiny Core

Model Number	Fab	CPU				GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 9000L	TSMC 5 nm+ FinFET (EUV)	ARMv8.2-A	Cortex-A77 Cortex-A55 DynamIQ	(1+2)+3	3.13 (A77 H) 2.54 (A77 L) 2.05 (A55)	Mali-G78 MP22	759 MHz (1068.7 GFLOPS in FP32)	LPDDR4X-2133 LPDDR5-2750	64-bit(4x16-bit) Quad-channel	34.1 (LPDDR4X) 44 (LPDDR5)	Beidou, Galileo, GLONASS	Balong 5000 (Sub-6-GHz only; NSA & SA)	Wi-Fi 6		Q4 2020	Huawei Mate 40E Pro
Kirin 9000E				(1+3)+4								Balong 5000 (Sub-6-GHz only; NSA & SA), 4G version available	—	—		List Huawei Mate 40 Huawei MatePad Pro 12.6
Kirin 9000						Mali-G78 MP24	759 MHz (1165.8 GFLOPS in FP32)						Wi-Fi 6			List Huawei Mate 40 Pro Huawei Mate 40 Pro+ Huawei Mate 40 RS Porsche Design Huawei P50 Pro Huawei Mate X2

Kirin 9000S and Kirin 9010 Family

The Kirin 9000S, Kirin 9000S1, and Kirin 9010 of the Kirin 9000 Hi36A0 family are the first HiSilicon-developed SoCs manufactured in high volumes in mainland China by SMIC. The SoC had its debut with the Huawei Mate 60 in late 2023 with the Kirin 9000S alongside overclocked enhancements of the Kirin 9000S1 and Kirin 9010 with the Huawei Pura 70 series in early 2024.^[35] According to Tom's Hardware, the Taishan V120 core, developed by HiSilicon, was roughly on par with AMD's Zen 3 cores from late 2020.^[36] Four of these cores were used in the 9000 series alongside four efficiency-focused Arm Cortex-A510 cores.^[37] The SoCs are based on SMIC's 7nm technology node, referred to as "N+2". It also includes 1 Da Vinci "big" NPU core and 1 Da Vinci "small" NPU core. Kirin 9000W, a Wi-Fi only SoC for the Huawei MatePad Pro 13.2 Wi-Fi only model, debuted in global markets in Q1 2024. The Kirin 9010 and Kirin 9000S1 debuted in Q2 2024, using a modified 2+6+4 core configuration with a new large Taishan core with the same configurations of medium and small cores from the Kirin 9000S with faster enhancements over the Kirin 9000S.^[38]

Model Number	Fab	CPU					GPU		Memory Technology			Nav	Wireless			Sampling availability	Devices using
		ISA	Microarchitecture	Cores (Total)	Threads (Total)	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
Kirin 9000S (Hi36A0)	SMIC 7 nm FinFET[39][40]	ARMv8.x	HiSilicon Taishan microarchitecture, Cortex-A510	1+3+4 (8)	2+6+4 (12)	2.62 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510)	HiSilicon Maleoon 910 (Up to 4 CUs / 1,024 ALUs)	750 MHz (Up to 1,536 GFLOPS in FP32)	LPDDR5-6400 LPDDR5X-8533	64-bit (4x16-bit) Quad-channel	51.2 (LPDDR5) 68.2 (LPDDR5X)	Beidou, Galileo, GLONASS	Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz)	Wi-Fi 6 (External Module)	Bluetooth 5.2, NearLink NFC	Q3 2023	List Huawei Mate 60 Huawei Mate 60 Pro Huawei Mate 60 Pro+ Huawei Mate 60 RS Ultimate Design Huawei Mate X5
Kirin 9000S1 (Hi36A0)						2.49 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510)										Q1 2024	Huawei Pura 70
Kirin 9000W (Hi36A0)													—			Q4 2023	List Huawei MatePad Pro 13.2 Huawei MatePad Air (2024)
Kirin 9000WL (Hi36A0)													—			Q2 2024	Huawei MatePad 11.5 S PaperMatte Edition
Kirin 9000WE (Hi36A0)													—			Q2 2024	Huawei MatePad 11.5 S (12GB RAM)
Kirin T90 (Hi36A0)													—			Q3 2024	Huawei MatePad Air (2024)
Kirin T90A (Hi36A0)													—			Q3 2024	Huawei MatePad 12 X
Kirin 9000SL (Hi36A0)				1+2+3 (6)	2+4+3 (9)	2.35 (TaishanV120) 2.15 (TaishanV120) 1.53 (Cortex-A510)							Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz)			Q4 2023	Huawei Nova 12 Ultra
Kirin 9000WM (Hi36A0)													—			Q2 2024	Huawei MatePad 11.5 S Smart Model
Kirin 9010 (Hi36A0)				1+3+4 (8)	2+6+4 (12)	2.30 (TaishanV121) 2.18 (TaishanV121) 1.55 (Cortex-A510)							Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz)			Q2 2024	List Huawei Pura 70 Pro Huawei Pura 70 Pro+ Huawei Pura 70 Ultra Huawei Mate XT Ultimate
Kirin 9010E (Hi36A0)						2.19 (TaishanV121) 2.18 (TaishanV121) 1.55 (Cortex-A510)										Q3 2024	Huawei Nova Flip
Kirin 9010A (Hi36A0)																Q3 2024
Kirin 9010W (Hi36A0)													—			Q3 2024
Kirin T91 (Hi36A0)													—			Q3 2024	Huawei MatePad Pro 12.2 (2024)
Kirin 9010L (Hi36A0)				1+2+3 (6)	2+4+3 (9)	2.19 (TaishanV121) 2.18 (TaishanV121) 1.40 (Cortex-A510)							Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz)			Q2 2024	Huawei Nova 12 Ultra Star Edition

Smartphone modems

HiSilicon develops smartphone modems which are primarily used in its parent company Huawei's handheld and tablet devices.

Balong 700

The Balong 700 supports LTE TDD/FDD.^[41] Its specs:

• 3GPP R8 protocol
• LTE TDD and FDD
• 4x2/2x2 SU-MIMO

Balong 710

At MWC 2012, HiSilicon released the Balong 710.^[42] It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative). The Balong 710 was designed to be used with the K3V2 SoC. Its specs:

• LTE FDD mode : 150 Mbit/s downlink and 50 Mbit/s uplink.
• TD-LTE mode: up to 112 Mbit/s downlink and up to 30 Mbit/s uplink.
• WCDMA Dual Carrier with MIMO: 84 Mbit/s downlink and 23 Mbit/s uplink.

Balong 720

The Balong 720 supports LTE Cat6 with 300 Mbit/s peak download rate.^[41] Its specs:

• TSMC 28 nm HPM process
• TD-LTE Cat.6 standard
• Dual-carrier aggregation for the 40 MHz bandwidth
• 5-mode LTE Cat6 Modem

Balong 750

The Balong 750 supports LTE Cat 12/13, and it is first to support 4CC CA and 3.5 GHz.^[41] Its specs:

• LTE Cat.12 and Cat.13 UL network standards
• 2CC (dual-carrier) data aggregation
• 4x4 multiple-input multiple-output (MIMO)
• TSMC 16 nm FinFET+ process

Balong 765

The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network.^[43] Its specs:

• 3GPP Rel.14
• LTE Cat.19 Peak data rate up to 1.6 Gbit/s
• 4CC CA + 4×4 MIMO/2CC CA + 8×8 MIMO
• DL 256QAM
• C-V2X

Balong 5G01

The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. It supports 5G across all frequency bands including sub-6 GHz and millimeter wave (mmWave).^[41] Its specs:

• 3GPP Release 15
• Peak data rate up to 2.3 Gbit/s
• Sub-6 GHz and mmWave
• NSA/SA
• DL 256QAM

Balong 5000

The Balong 5000 is the world's first 7 nm TSMC 5G multi-mode chipset (launched in Q1 2019), the world's first SA/NSA implementation, and the first smartphone chipset to support the full NR TDD/FDD spectrum.^[44] The modem has an advanced 2G, 3G, 4G, and 5G connectivity.^[45] Its specs:

• 2G/3G/4G/5G Multi Mode
• Fully compliant with 3GPP Release 15
• Sub-6 GHz: 100 MHz x 2CC CA
• Sub-6 GHz: Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s
• mmWave: Downlink up to 6.5 Gbit/s, Uplink up to 3.5 Gbit/s
• NR+LTE: Downlink up to 7.5 Gbit/s
• FDD & TDD Spectrum Access
• SA & NSA Fusion Network Architecture
• Supports 3GPP R14 V2X
• 3 GB LPDDR4X RAM^[46]

Wearable SoCs

HiSilicon develops SoCs for wearables such as wireless earbuds, wireless headphones, neckband earbuds, smart speakers, smart eyewear, and smartwatches.^[47]

Kirin A1

The Kirin A1 (Hi1132) was announced on 6 September 2019.^[47] It features:

• BT/BLE dual-mode Bluetooth 5.1^[48]
• Isochronous Dual Channel transmission technology
• 356 MHz audio processor
• Cortex-M7 microprocessor

Kirin A2

The Kirin A2 was announced on September 25, 2023.^[49] It features:

• Faster Transmission
• Stable signal with Polar code technology
• Increase of 50% in computing power performance
• Audio Vivid

Server processors

HiSilicon develops server processor SoCs based on the ARM architecture.

Hi1610

The Hi1610 is HiSilicon's first generation server processor announced in 2015. It features:

• 16x ARM Cortex-A57 at up to 2.1 GHz^[50]
• 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 16 MB CCN L3
• TSMC 16 nm
• 2x DDR4-1866
• 16 PCIe 3.0

Hi1612

The Hi1612 is HiSilicon's second generation server processor launched in 2016. It is the first chiplet-based Kunpeng with two computing dies. It features:

• 32x ARM Cortex-A57 at up to 2.1 GHz^[50]
• 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 32 MB CCN L3
• TSMC 16 nm
• 4x DDR4-2133
• 16 PCIe 3.0

Kunpeng 916 (formerly Hi1616)

The Kunpeng 916 (formerly known as Hi1616) is HiSilicon's third generation server processor launched in 2017. The Kunpeng 916 is used in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server.^{[51][52][53][54]} It features:

• 32x ARM Cortex-A72 at up to 2.4 GHz^[50]
• 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 32 MB CCN L3
• TSMC 16 nm
• 4x DDR4-2400
• 2-way Symmetric multiprocessing (SMP), Each socket has 2x ports with 96 Gbit/s per port (total of 192 Gbit/s per each socket interconnects)
• 46 PCIe 3.0 and 8x 10 Gigabit Ethernet
• 85 W

Kunpeng 920 (formerly Hi1620)

The Kunpeng 920 (formerly known as Hi1620) is HiSilicon's fourth generation server processor announced in 2018, and launched in 2019. Huawei claims the Kunpeng 920 CPU scores more than an estimated 930 on SPECint_rate_base2006.^[55] The Kunpeng 920 is used in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server, and TaiShan XA320 V2 High-Density Server Node.^[56][57][58] It features:

• 32 to 64x custom TaiShan V110 cores at up to 2.6 GHz.^[59]
• The TaiShan V110 core is a 4-way superscalar, out-of-order microarchitecture that implements the ARMv8.2-A ISA. Huawei reports the core supports almost all the ARMv8.4-A ISA features with a few exceptions, including the dot product and FP16 FML extensions.^[59]
• The TaiShan V110 cores are likely a new core not based on ARM designs^{[60][original research?]}
• 3x Simple ALUs, 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3), 2x FSUs (ASIMD FPU), 2x LSUs^[60]
• 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1 MB L3/core Shared.
• TSMC 7 nm HPC
• 8x DDR4-3200
• 2-way and 4-way symmetric multiprocessing (SMP). Each socket has 3x Hydra ports with 240 Gbit/s per port (total of 720 Gbit/s per each socket interconnects)
• 40 PCIe 4.0 with CCIX support, 4x USB 3.0, 2x SATA 3.0, 8x SAS 3.0 and 2x 100 gigabit ethernet
• 100 to 200 W
• Compression engine (GZIP, LZS, LZ4) capable of up to 40 Git/s compress and 100 Gbit/s decompress
• Crypto offload engine (for AES, DES, 3DES, SHA1/2, etc..) capable of throughputs up to 100 Gbit/s

Kunpeng 930 (formerly Hi1630)

The Kunpeng 930 (formerly known as Hi1630) is HiSilicon's fifth-generation server processor announced in 2019 and scheduled for launch in 2021. It features:

• 80 custom TaishanV120 cores at 3 GHz frequency, with support for simultaneous multithreading (SMT) and ARM's Scalable Vector Extension (SVE).^[59]
• 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1 MB L3/core Shared
• TSMC 5 nm
• 8x DDR5

Kunpeng 950

The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023.

AI acceleration

HiSilicon also develops AI Acceleration chips.

Da Vinci architecture

Each Da Vinci Max AI Core features a 3D Cube Tensor Computing Engine (4096 FP16 MACs + 8192 INT8 MACs), a vector unit (2048bit INT8/FP16/FP32), and a scalar unit. It includes a new AI framework called "MindSpore", a platform-as-a-service product called ModelArts, and a lower-level library called Compute Architecture for Neural Networks (CANN).^[31]

Ascend 310

The Ascend 310 is an AI inference SoC, it was codenamed Ascend-Mini. The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16.^[61] The Ascend 310 features:

• 2x Da Vinci Max AI cores^[31]
• 8x ARM Cortex-A55 CPU cores
• 8 MB on-chip buffer
• 16 channel video decode – H.264/H.265
• 1 channel video encode – H.264/H.265
• TSMC 12 nm FFC process
• 8W TDP

Ascend 910

The Ascend 910 is an AI training SoC, it was codenamed Ascend-Max. which delivers 256 TFLOPS@FP16 and 512 TOPS@INT8. The Ascend 910 features:

• 32x Da Vinci Max AI cores arranged in 4 clusters^[31]
• 1024-bit NoC Mesh @ 2 GHz, with 128 GB/s bandwidth Read/Write per core
• 3x 240 Gbit/s HCCS ports for Numa connections
• 2x 100 Gbit/s RoCE interfaces for networking
• 4x HBM2E, 1.2 TB/s bandwidth
• 3D-SRAM stacked below AI SoC die
• 1228 mm² Total die size (456 mm² Virtuvian AI SoC, 168 mm² Nimbus V3 IO Die, 4x96 mm² HBM2E, 2x110 mm² Dummy Die)
• 32 MB on-chip buffer
• 128 channel video decode – H.264/H.265
• TSMC 7 nm EUV (N7+) process
• 350 W

See also

• Companies portal

• Semiconductor industry
• Semiconductor industry in China

References

1. "HiSilicon Technologies Co., Ltd.: Private Company Information". Bloomberg. Archived from the original on 19 January 2019. Retrieved 18 January 2019.
2. HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications Archived 27 January 2013 at the Wayback Machine, 2 August 2011 on ARM.com
3. "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Archived from the original on 15 January 2013. Retrieved 26 April 2013.
4. ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors Archived 5 January 2013 at the Wayback Machine on ARM.com
5. Lai, Richard (9 January 2013). "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Archived from the original on 15 May 2013. Retrieved 26 April 2013.
6. "Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Archived from the original on 21 August 2014. Retrieved 26 April 2013.
7. Josh, Horwitz (21 May 2020). "U.S. strikes at a Huawei prize: chip juggernaut HiSilicon". Reuters. Archived from the original on 22 May 2020. Retrieved 22 May 2020.
8. "Huawei to stop making flagship chipsets as U.S. pressure bites, Chinese media say". Reuters. 8 August 2020. Retrieved 8 August 2020.
9. "Best of Android 2016: Performance". Android Authority. 29 December 2016. Retrieved 18 May 2021.
10. "HiSilicon No Longer Just an Internal Unit for Huawei". EE Times Asia. 3 January 2020. Retrieved 18 May 2021.
11. brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked Archived 8 May 2013 at the Wayback Machine on ARMdevices.net
12. Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate Archived 29 June 2019 at the Wayback Machine on Anandtech
13. "Hi6220V100 Multi-Mode Application Processor: Function Description" (PDF). 96Boards' github. 29 December 2014.
14. "Kirin 620". www.hisilicon.com. Retrieved 10 April 2021.
15. "HiSilicon Kirin 650 SoC – Benchmarks and Specs". www.notebookcheck.net. Archived from the original on 5 February 2017. Retrieved 4 February 2017.
16. Mallick, Subhrojit (18 January 2020). "Is the Kirin 710F in the Honor 9X any different from the Kirin 710? | Digit". digit.in. Retrieved 2 July 2020.
17. "Huawei HiSilicon's new 14nm Kirin 710A chip was manufactured by Shanghai-based SMIC". xda-developers. 13 May 2020. Retrieved 2 July 2020.
18. Huawei、秘密裏にKirin 8000を市場に投入
19. "Huawei MediaPad X1". DeviceSpecifications. Archived from the original on 23 July 2014. Retrieved 14 March 2014.
20. "Huawei P6 S". Huawei. Archived from the original on 22 June 2014. Retrieved 12 June 2014.
21. "Huawei MediaPad M1". DeviceSpecifications. Archived from the original on 29 April 2015. Retrieved 14 March 2014.
22. "Huawei Honor 6". DeviceSpecifications. Archived from the original on 27 June 2014. Retrieved 25 June 2014.
23. "Huawei Ascend Mate 8/Honor 7's Kirin 940/950 Processor Performance & Specs". Archived from the original on 16 March 2015. Retrieved 13 May 2015.
24. "HUAWEI MediaPad M3 8.0". Huawei-Consumer. Huawei. Archived from the original on 20 November 2016. Retrieved 18 January 2017.
25. "Kirin 955, Huawei P9, P9 Plus". Archived from the original on 9 April 2016. Retrieved 7 April 2016.
26. "Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA". AnandTech. 19 October 2016. Archived from the original on 20 October 2016. Retrieved 19 October 2016.
27. Frumusanu, Andrei. "HiSilicon Kirin 970 – Android SoC Power & Performance Overview". www.anandtech.com. Archived from the original on 28 January 2019. Retrieved 28 January 2019.
28. Cutress, Ian. "Cambricon, Makers of Huawei's Kirin NPU IP, Build A Big AI Chip and PCIe Card". www.anandtech.com. Archived from the original on 28 January 2019. Retrieved 28 January 2019.
29. Hinum, Klaus (12 October 2018). "ARM Mali-G76 MP10". Notebookcheck. Archived from the original on 4 December 2018. Retrieved 3 December 2018.{{cite web}}: CS1 maint: numeric names: authors list (link)
30. "Kirin". www.hisilicon.com. Archived from the original on 2 October 2019. Retrieved 21 September 2019.
31. Cutress, Dr Ian. "Hot Chips 31 Live Blogs: Huawei Da Vinci Architecture". www.anandtech.com. Archived from the original on 21 August 2019. Retrieved 21 August 2019.
32. "Kirin 9000". www.hisilicon.com. Retrieved 16 September 2021.
33. Shilov, Anton (5 January 2024). "Huawei's 5nm Kirin 9006C laptop chip was reportedly produced by TSMC in 2020, dispelling production rumors at Chinese fab SMIC". tom's HARDWARE. Retrieved 6 February 2024.
34. AleksandarK (7 December 2021). "Huawei Prepares Laptop Powered by Custom Kirin 5 nm SoC and DDR5 Memory". TechPowerUp. Retrieved 6 February 2024.
35. "Huawei Pura 70 series of smartphones launched - TechCentral". 18 April 2024. Retrieved 18 April 2024.
36. Matthew Connatser (25 February 2024). "Huawei's new CPU matches Zen 3 in single-core performance - HiSilicon Taishan V120 server CPU benchmark". Tom's Hardware. Retrieved 3 April 2024.
37. Anton Shilov (3 September 2023). "Huawei's New Mystery 7nm Chip from Chinese Fab Defies US Sanctions". Tom's Hardware. Retrieved 3 April 2024.
38. Sohail, Omar (18 April 2024). "Kirin 9010 Is Huawei's Latest Smartphone SoC With A 12-core CPU Cluster, Is Regarded As A Faster Variant To The Kirin 9000S, Lithography Unknown". Wccftech. Retrieved 21 April 2024.
39. NanoReview.net. "HiSilicon Kirin 9000S".
40. The Nikkei. "美智库：华为7纳米芯片是对华包围网的失败" (in Chinese).
41. "Balong". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 5 May 2019.
42. "HiSilicon Releases Leading LTE Multi-mode Chipset | HiSilicon". www.hisilicon.com. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
43. "Huawei Launches the World's First 8-Antenna 4.5G Modem Chipset". www.hisilicon.com. Archived from the original on 17 May 2019. Retrieved 5 May 2019.
44. "Balong 5000". www.hisilicon.com. Retrieved 16 September 2021.
45. "Huawei Launches Industry-Leading 5G Multi-Mode Chipset Balong 5000 to Lead the 5G Era". www.hisilicon.com. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
46. "Huawei Mate 20 X 5G Teardown". iFixit. 25 July 2019. Archived from the original on 27 July 2019. Retrieved 27 July 2019.
47. S, Amy (7 September 2019). "Kirin A1: The world's first Bluetooth 5.1 and Bluetooth Low Energy 5.1 Wearable Chip". Huawei Central. Archived from the original on 21 September 2019. Retrieved 21 September 2019.
48. "HUAWEI FreeBuds 3, Kirin A1, Intelligent Noise Cancellation | HUAWEI Global". consumer.huawei.com. Archived from the original on 21 September 2019. Retrieved 21 September 2019.
49. Ouz. "Huawei FreeBuds Pro 3 Launches with Kirin A2 Chip and Ultra Lossless Sound Quality". GIZMOCHINA. Retrieved 5 February 2024.
50. Cutress, Ian. "Huawei Server Efforts: Hi1620 and Arm's Big Server Core, Ares". www.anandtech.com. Archived from the original on 9 June 2019. Retrieved 4 May 2019.
51. "TaiShan 2280 Balanced Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
52. "TaiShan 5280 Storage Server". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
53. "TaiShan XA320 High-Density Server Node". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
54. "TaiShan X6000 ARM High-Density Server". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
55. "Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 4 May 2019.
56. "TaiShan 2280 V2 Balanced Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
57. "TaiShan 5280 V2 Storage Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
58. "TaiShan XA320 V2 High-Density Server Node". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
59. Schor, David (3 May 2019). "Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen". WikiChip Fuse. Archived from the original on 4 May 2019. Retrieved 4 May 2019.
60. "gcc.gnu.org Git – gcc.git/blob – gcc/config/aarch64/tsv110.md". gcc.gnu.org. Retrieved 13 June 2019.
61. "Ascend | HiSilicon". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 4 May 2019.

External links

• Official website