AMD Instinct

AMD Instinct is AMD's brand of data center GPUs.^[1][2] It replaced AMD's FirePro S brand in 2016. Compared to the Radeon brand of mainstream consumer/gamer products, the Instinct product line is intended to accelerate deep learning, artificial neural network, and high-performance computing/GPGPU applications.

AMD Instinct

Release date	June 20, 2017; 7 years ago (2017-06-20)
Designed by	AMD
Marketed by	AMD
Architecture	GCN 3 GCN 4 GCN 5 CDNA CDNA 2 CDNA 3
Models	MI Series
Cores	36-304 Compute Units (CUs)
Transistors	5.7B (Polaris10) 14 nm 8.9B (Fiji) 28 nm 12.5B (Vega10) 14 nm 13.2B (Vega20) 7 nm 25.6B (Arcturus) 7 nm 58.2B (Aldebaran) 6 nm 146B (Antares) 5 nm 153B (Aqua Vanjaram) 5 nm
History
Predecessor	AMD FirePro Radeon Sky series

The AMD Instinct product line directly competes with Nvidia's Tesla and Intel's Xeon Phi and Data Center GPU lines of machine learning and GPGPU cards.

The brand was originally known as AMD Radeon Instinct, but AMD dropped the Radeon brand from the name before AMD Instinct MI100 was introduced in November 2020.

In June 2022, supercomputers based on AMD's Epyc CPUs and Instinct GPUs took the lead on the Green500 list of the most power-efficient supercomputers with over 50% lead over any other, and held the top first 4 spots.^[3] One of them, the AMD-based Frontier is since June 2022 and as of 2023 the fastest supercomputer in the world on the TOP500 list.^[4][5]

Products

Top view of an AMD Radeon Instinct MI50 card.

AMD Instinct GPU generations

Accelerator	Launch date	Architecture	Lithography	Compute Units	Memory			PCIe support	Form factor	Processing power								TBP
					Size	Type	Bandwidth (GB/s)			FP16	BF16	FP32	FP32 matrix	FP64 performance	FP64 matrix	INT8	INT4
MI6	2016-12-12[6]	GCN 4	14 nm	36	16 GB	GDDR5	224	3.0	PCIe	5.7 TFLOPS	N/A	5.7 TFLOPS	N/A	358 GFLOPS	N/A	N/A	N/A	150 W
MI8		GCN 3	28 nm	64	4 GB	HBM	512			8.2 TFLOPS		8.2 TFLOPS		512 GFLOPS				175 W
MI25		GCN 5	14 nm		16 GB	HBM2	484			26.4 TFLOPS		12.3 TFLOPS		768 GFLOPS				300 W
MI50	2018-11-06[7]		7 nm	60			1024	4.0		26.5 TFLOPS		13.3 TFLOPS		6.6 TFLOPS		53 TOPS		300 W
MI60				64	32 GB					29.5 TFLOPS		14.7 TFLOPS		7.4 TFLOPS		59 TOPS		300 W
MI100	2020-11-16	CDNA		120			1200			184.6 TFLOPS	92.3 TFLOPS	23.1 TFLOPS	46.1 TFLOPS	11.5 TFLOPS		184.6 TOPS		300 W
MI210	2022-03-22[8]	CDNA 2	6 nm	104	64 GB	HBM2e	1600			181 TFLOPS		22.6 TFLOPS	45.3 TFLOPS	22.6 TFLOPS	45.3 TFLOPS	181 TOPS		300 W
MI250	2021-11-08[9]			208	128 GB		3200		OAM	362.1 TFLOPS		45.3 TFLOPS	90.5 TFLOPS	45.3 TFLOPS	90.5 TFLOPS	362.1 TOPS		560 W
MI250X				220						383 TFLOPS		47.92 TFLOPS	95.7 TFLOPS	47.9 TFLOPS	95.7 TFLOPS	383 TOPS		560 W
MI300A	2023-12-06[10]	CDNA 3	6 & 5 nm	228	128 GB	HBM3	5300	5.0	APU SH5 socket	980.6 TFLOPS 1961.2 TFLOPS (with Sparsity)		122.6 TFLOPS		61.3 TFLOPS	122.6 TFLOPS	1961.2 TOPS 3922.3 TOPS (with Sparsity)	N/A	550 W 760 W (with liquid cooling)
MI300X				304	192 GB				OAM	1307.4 TFLOPS 2614.9 TFLOPS (with Sparsity)		163.4 TFLOPS		81.7 TFLOPS	163.4 TFLOPS	2614.9 TOPS 5229.8 TOPS (with Sparsity)	N/A	750 W
MI325X	2024-06-02[11]				288 GB	HBM3e	6000

The three initial Radeon Instinct products were announced on December 12, 2016, and released on June 20, 2017, with each based on a different architecture.^[12][13]

MI6

The MI6 is a passively cooled, Polaris 10 based card with 16 GB of GDDR5 memory and with a <150 W TDP.^[1][2] At 5.7 TFLOPS (FP16 and FP32), the MI6 is expected to be used primarily for inference, rather than neural network training. The MI6 has a peak double precision (FP64) compute performance of 358 GFLOPS.^[14]

MI8

The MI8 is a Fiji based card, analogous to the R9 Nano, has a <175W TDP.^[1] The MI8 has 4 GB of High Bandwidth Memory. At 8.2 TFLOPS (FP16 and FP32), the MI8 is marked toward inference. The MI8 has a peak (FP64) double precision compute performance 512 GFLOPS.^[15]

MI25

The MI25 is a Vega based card, utilizing HBM2 memory. The MI25 performance is expected to be 12.3 TFLOPS using FP32 numbers. In contrast to the MI6 and MI8, the MI25 is able to increase performance when using lower precision numbers, and accordingly is expected to reach 24.6 TFLOPS when using FP16 numbers. The MI25 is rated at <300W TDP with passive cooling. The MI25 also provides 768 GFLOPS peak double precision (FP64) at 1/16th rate.^[16]

MI300 series

The MI300A and MI300X are data center accelerators that use the CDNA 3 architecture, which is optimized for high-performance computing (HPC) and generative artificial intelligence (AI) workloads. The CDNA 3 architecture features a scalable chiplet design that leverages TSMC’s advanced packaging technologies, such as CoWoS (chip-on-wafer-on-substrate) and InFO (integrated fan-out), to combine multiple chiplets on a single interposer. The chiplets are interconnected by AMD’s Infinity Fabric, which enables high-speed and low-latency data transfer between the chiplets and the host system.

The MI300A is an accelerated processing unit (APU) that integrates 24 Zen 4 CPU cores with four CDNA 3 GPU cores, resulting in a total of 228 CUs in the GPU section, and 128 GB of HBM3 memory. The Zen 4 CPU cores are based on the 5 nm process node and support the x86-64 instruction set, as well as AVX-512 and BFloat16 extensions. The Zen 4 CPU cores can run general-purpose applications and provide host-side computation for the GPU cores. The MI300A has a peak performance of 61.3 TFLOPS of FP64 (122.6 TFLOPS FP64 matrix) and 980.6 TFLOPS of FP16 (1961.2 TFLOPS with sparsity), as well as 5.3 TB/s of memory bandwidth. The MI300A supports PCIe 5.0 and CXL 2.0 interfaces, which allow it to communicate with other devices and accelerators in a heterogeneous system.

The MI300X is a dedicated generative AI accelerator that replaces the CPU cores with additional GPU cores and HBM memory, resulting in a total of 304 CUs (64 cores per CU) and 192 GB of HBM3 memory. The MI300X is designed to accelerate generative AI applications, such as natural language processing, computer vision, and deep learning. The MI300X has a peak performance of 653.7 TFLOPS of TP32 (1307.4 TFLOPS with sparsity) and 1307.4 TFLOPS of FP16 (2614.9 TFLOPS with sparsity), as well as 5.3 TB/s of memory bandwidth. The MI300X also supports PCIe 5.0 and CXL 2.0 interfaces, as well as AMD’s ROCm software stack, which provides a unified programming model and tools for developing and deploying generative AI applications on AMD hardware.^[17][18][19]

Software

Main article: ROCm

ROCm

Following software is, as of 2022, regrouped under the Radeon Open Compute meta-project.

MxGPU

The MI6, MI8, and MI25 products all support AMD's MxGPU virtualization technology, enabling sharing of GPU resources across multiple users.^[1][20]

MIOpen

MIOpen is AMD's deep learning library to enable GPU acceleration of deep learning.^[1] Much of this extends the GPUOpen's Boltzmann Initiative software.^[20] This is intended to compete with the deep learning portions of Nvidia's CUDA library. It supports the deep learning frameworks: Theano, Caffe, TensorFlow, MXNet, Microsoft Cognitive Toolkit, Torch, and Chainer. Programming is supported in OpenCL and Python, in addition to supporting the compilation of CUDA through AMD's Heterogeneous-compute Interface for Portability and Heterogeneous Compute Compiler.

Chipset table

The Vega 20 GPU on the Instinct MI50

Model (Code name)	Launch	Architecture & fab	Transistors & die size	Core		Fillrate[a][b][c]		Processing power[a][d] (TFLOPS)			Memory				TBP	Bus interface
				Config[e]	Clock[a] (MHz)	Texture (GT/s)	Pixel (GP/s)	Half	Single	Double	Size (GB)	Bus type & width	Bandwidth (GB/s)	Clock (MT/s)
Radeon Instinct MI6 (Polaris 10)[21][22][23][24][25][26]	Jun 20, 2017	GCN 4 GloFo 14LP	5.7×109 232 mm2	2304:144:32 36 CU	1120 1233	161.3 177.6	35.84 39.46	5.161 5.682	5.161 5.682	0.323 0.355	16	GDDR5 256-bit	224	7000	150 W	PCIe 3.0 ×16
Radeon Instinct MI8 (Fiji)[21][22][23][27][28][29]		GCN 3 TSMC 28 nm	8.9×109 596 mm2	4096:256:64 64 CU	1000	256.0	64.00	8.192	8.192	0.512	4	HBM 4096-bit	512	1000	175 W
Radeon Instinct MI25 (Vega 10)[21][22][23][30][31][32][33]		GCN 5 GloFo 14LP	12.5×109 510 mm2		1400 1500	358.4 384.0	89.60 96.00	22.94 24.58	11.47 12.29	0.717 0.768	16	HBM2 2048-bit	484	1890	300 W
Radeon Instinct MI50 (Vega 20)[34][35][36][37][38][39]	Nov 18, 2018	GCN 5 TSMC N7	13.2×109 331 mm2	3840:240:64 60 CU	1450 1725	348.0 414.0	92.80 110.4	22.27 26.50	11.14 13.25	5.568 6.624	16 32	HBM2 4096-bit	1024	2000		PCIe 4.0 ×16
Radeon Instinct MI60 (Vega 20)[35][40][41][42]				4096:256:64 64 CU	1500 1800	384.0 460.8	96.00 115.2	24.58 29.49	12.29 14.75	6.144 7.373	32
AMD Instinct MI100 (Arcturus)[43][44][45]	Nov 16, 2020	CDNA TSMC N7	25.6×109 750 mm2	7680:480:- 120 CU	1000 1502	480.0 721.0	—	122.9 184.6	15.36 23.07	7.680 11.54			1228.8	2400
AMD Instinct MI210 (Aldebaran)[46][47][48]	Mar 22, 2022	CDNA 2 TSMC N6	28 x 109 ~770 mm2	6656:416:- 104 CU (1 × GCD)[f]	1000 1700	416.0 707.2		106.5 181.0	13.31 22.63	13.31 22.63	64	HBM2E 4096-bit	1638.4	3200
AMD Instinct MI250 (Aldebaran)[49][50][51]	Nov 8, 2021		58 x 109 1540 mm2	13312:832:- 208 CU (2 × GCD)		832.0 1414		213.0 362.1	26.62 45.26	26.62 45.26	2 × 64	HBM2E 2 × 4096-bit[g]	2 × 1638.4		500 W 560 W (Peak)
AMD Instinct MI250X (Aldebaran)[52][50][53]				14080:880:- 220 CU (2 × GCD)		880.0 1496		225.3 383.0	28.16 47.87	28.16 47.87
AMD Instinct MI300A (Antares)[54][55][56][57]	Dec 6, 2023	CDNA 3 TSMC N5 & N6	146 x 109 1017 mm2	14592:912:- 228 CU (6 × XCD) (24 AMD Zen 4 x86 CPU cores)	2100	912.0 1550.4		980.6 1961.2 (With Sparsity)	122.6	61.3 122.6 (FP64 Matrix)	128	HBM3 8192-bit	5300	5200	550 W 760 W (Liquid Cooling)	PCIe 5.0 ×16
AMD Instinct MI300X (Aqua Vanjaram)[58][59][60][61]			153 x 109 1017 mm2	19456:1216:- 304 CU (8 × XCD)		1216.0 2062.1		1307.4 2614.9 (With Sparsity)	163.4	81.7 163.4 (FP64 Matrix)	192				750 W

• v
• t
• e

1. Boost values (if available) are stated below the base value in italic.
2. Texture fillrate is calculated as the number of texture mapping units multiplied by the base (or boost) core clock speed.
3. Pixel fillrate is calculated as the number of render output units multiplied by the base (or boost) core clock speed.
4. Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
5. Unified shaders : Texture mapping units : Render output units and Compute units (CU)
6. GCD Refers to a Graphics Compute Die. Each GCD is a different piece of silicon.
7. CDNA 2.0 Based cards adopt a design using two dies on the same package.They are linked with 400GB/s Bidirectional Infinity Fabric link, The dies are addressed as individual GPUs by the host system.

See also

• ROCm - AMD's open compute software stack
• AMD FirePro - AMD's predecessor to AMD Instinct
• AMD Radeon Pro - AMD's workstation graphics and GPGPU solution
• Nvidia Tesla - Nvidia's competing GPGPU solution
• List of AMD graphics processing units

References

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External links

• AMD Instinct accelerators web page