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Extreme ultraviolet lithography
Lithography using 13.5 nm UV light / From Wikipedia, the free encyclopedia
Extreme ultraviolet lithography (EUVL, also known simply as EUV) is a new technology used in the semiconductor industry for manufacturing integrated circuits (ICs). It is a type of photolithography that uses extreme ultraviolet (EUV) light to create intricate patterns on silicon wafers.
As of 2023[update], ASML Holding is the only company that produces and sells EUV systems for chip production, targeting 5 nanometer (nm) and 3 nm process nodes.
The EUV wavelengths that are used in EUVL are near 13.5 nanometers (nm), using a laser-pulsed tin (Sn) droplet plasma (Sn ions in the ionic states from Sn IX to Sn XIV give photon emission spectral peaks around 13.5 nm from 4p64dn ā 4p54dn+1 + 4dnā14f ionic state transitions.[1]), to produce a pattern by using a reflective photomask to expose a substrate covered by photoresist.
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